Teradyne, Inc.

Besi North America, Inc.

John D Moore

Andreas C Pfahnl

Miroslaw Sokol

Lawrence Roberts

Luis A Muller

Erik C Svendsen

A robotic die sorter having pick and place arm assemblies and a multi-camera optical inspection system is disclosed. A pick arm of the pick arm assembly picks a die from a semiconductor wafer, and a place arm of the place arm assembly receives the die from the pick arm and places same in a reel of pocketed tape. After picking, the pick arm and the place arm are rotated into facing arrangement, whereupon the die is transferred to the place head of the place arm and a camera of the optical inspection system to detect defects in the die. After inspection, the place arm rotates toward the pocketed tape and places the die into the pocketed tape. Additional cameras of the optical inspection system allow for calibration of the pick and place arms, as well as monitoring of the die transfer process.

Robotic die sorter with optical inspection system

A test cell for use in a semiconductor manufacturing operation allowing alignment of semiconductor devices to be tested to a test station. The test cell is well suited for testing semiconductor devices on carrier strips. To aid in alignment, the test cell includes a down-ward looking camera and a simple upward looking sensor. Fiducials are acurately positioned relative to the test site, which are easily detected by the simple sensor. A controller within the test cell uses the output of the camera and the sensor, in conjunction with position sensors on a robotic assembly, to determine relative positions of the devices to be tested and the test station and issue the appropriate commands to align the devices to the test station.

Semiconductor handler interface auto alignment

A strip, leadframe or panel type handling device for use in testing semiconductor components. The handling device has a thermal plate assembly with embedded electrical resistance heaters. The heaters are separately controlled in zones to provide uniform temperature across the plate for elevated temperature testing. Cooling channels are formed in the plate. Intermingling channels are provided to allow different types of cooling fluids to be used to cool at different rates or hold a cold temperature at different levels. The cooling channels can likewise be provided in zones to promote temperature uniformity. Vacuum channels are used to hold the semiconductor parts under test in close contact with the thermal plate.

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Deerfield, NH, United States of America

John D Moore