3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

John D Geissinger

Robin E Gorrell

Howard M Kaplan

Donald George Peterson

Robert R Kieschke

Paul Marian Harvey

Randolph D Schueller

Douglas B Gundel

Alexander Barr

Joseph N Castiglione

Ravi Palaniswamy

Mark M Lettang

Justine A Mooney

Siang Sin Foo

Anthony R Plepys

Dennis L Doye

Brent D Lunceford

Howard Edwin Evans

Phillip J Bergeron

Thomas Suniga

A cable assembly is disclosed. The cable assembly includes a printed circuit board (PCB) including a plurality of alternating ground pads and groups of signal pads, and a cable comprising a plurality of spaced apart differential pairs. Each differential pair defines a stripped section and an unstripped section, and the stripped sections terminate at corresponding signal pads of a corresponding group of signal pads of the PCB. An electrically conductive shield includes a cover portion disposed on and covering at least a portion of the unstripped sections of the insulated conductors and a plurality of spaced apart walls. Each wall is disposed between the stripped sections of the insulated conductors of two adjacent differential pairs and extending from the cover portion to, and making electrical contact with, a corresponding ground pad disposed between the groups of signal pads corresponding to the adjacent differential pairs.

Cable assembly with crosstalk barrier

A multilayer stack includes a first stretchable layer having a first length, a first adhesive layer disposed on a top surface of the first stretchable layer and having the first length, a second stretchable layer disposed on a top surface of the first adhesive layer and having a second length smaller than the first length, a radio frequency identification tag including an antenna having a spiral form and disposed on a top surface of the second stretchable layer or on a bottom surface of the second stretchable layer, a second adhesive layer disposed on the second stretchable layer and having a third length less than the first length and greater than the second length where the second adhesive layer encapsulates the second stretchable layer, and a third stretchable layer disposed on a top surface of the second adhesive layer and having the third length.

Multilayer stack including RFID tag

A film assembly or a multilayer stack can include an antenna having a spiral form disposed on a stretchable layer. The film assembly includes a stretchable substrate having opposite major top and bottom surfaces, and a first material disposed on the major top surface of the stretchable substrate in the form of a plurality of intersecting rows and columns making the film assembly less stretchable than the stretchable substrate. The rows and columns define a plurality of closed cells. An antenna for use in a radio frequency identification tag is disposed on the stretchable substrate in each closed cell and is isolated from the first material. The antenna includes an elongated electrically conductive electrode having a spiral form.

Film assembly and multilayer stack including antenna

A radio frequency identification tag including a stretchable substrate folded along a fold line to form top and bottom stretchable fold portions is described. Each fold portion has major top and bottom surfaces with the major top surface of the bottom fold portion facing the major bottom surface of the top fold portion. An antenna having a spiral form is disposed on the major top surface of the top fold portion. First and second terminals are disposed on the major top surface of the top fold portion and are in electrical communication with respective first and second ends of the antenna. A meandering electrode is disposed on the major bottom surface of the bottom fold portion and has first and second electrode ends making crimp connections with the respective first and second terminals.

RFID tag on stretchable substrate

A radio frequency identification (RFID) tag that includes an antenna having a spiral form disposed on a major surface of a flexible substrate is described. The RFID tag includes a first terminal disposed at a first end of the antenna and a second terminal disposed at the second end of the antenna. The RFID tag may include a pad portion along the length of the antenna between the first and second ends for mounting an integrated circuit. Except for the pad portion, a radius of curvature of the antenna along at least 90 percent of a length of the antenna between the first and second ends is greater than about 0.1 mm and less than about 10 mm.

RFID tag on flexible substrate

A radio frequency identification tag including a stretchable substrate () and an antenna () having a plurality of substantially concentric loops () disposed on the substrate is described. A radius of curvature of the antenna along at least 90% of each loop of the antenna may be greater than about 0.1 mm and less than about 5 mm. The antenna includes a first terminal () disposed within an innermost loop () of the antenna and a second terminal () disposed outside an outermost loop () of the antenna (). The first terminal () is in electrical communication with a first end () of the antenna and the second terminal () is in electrical communication with a second end () of the antenna. The radio frequency identification tag may include an electrode making electrical connections with the first and second terminals.

A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

MEMS devices on flexible substrate

Generally provided is a circuit assembly construction for controlling impedance in an electronic package. A large scale, parallel-plate capacitor includes two electrodes separated by a dielectric material. The electrodes serve as reference voltage planes for the electronic package. At least one of the electrodes is patterned such that both electrodes are accessible from a common side of the capacitor. The capacitor is positioned with a first electrode mounted adjacent to an interconnect circuit portion of the electronic package. An electronic device portion of the electronic package is electrically connected, directly or indirectly, to one or more of the electrodes of the capacitor.

Electronic package with integrated capacitor

An electronic package including a conductive trace layer having a first side and a second side. The conductive trace layer is patterned to define a plurality of interconnect pads. A flexible dielectric substrate is mounted on the first side of the conductive trace layer. A flexible capacitor including a first conductive layer, a second conductive layer and a layer of dielectric material disposed between the first and the second conductive layers is mounted with the first conductive layer adjacent to the second side of the conductive trace layer. A plurality of interconnect regions extend through the first conductive layer and the dielectric material layer of the capacitor. An interconnect member is connected between each one of the conductive layers of the capacitor and a corresponding set of the interconnect pads. The first conductive layer of the capacitor is electrically connected to a first set of the interconnect pads and the second conductive layer of the capacitor is electrically connected to a second set of the interconnect pads. The interconnect members corresponding to the second set of interconnect pads extend through one of the interconnect regions. An aperture extends through the dielectric substrate adjacent to each one of the interconnect pads. A stiffening member is mounted adjacent to the second conductive layer of the capacitor. A device receiving region is formed through the dielectric substrate, the conductive trace layer and the capacitor.

A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format.

Chip scale ball grid array for integrated circuit package

A ball grid array (BGA) package is provided in which the stiffener of the BGA may also be utilized as a conductive layer. A TAB tape is adhered to the stiffener by an adhesive and both the TAB tape and the adhesive may have vias which open to the stiffener. Conductive plugs which may be formed of solder paste, conductive adhesives, or the like may then be filled in the vias to provide electrical connection from the TAB tape to the stiffener. The vias may be located adjacent to solder ball locations. The TAB tape may include multiple conductor layers or multiple layers of single conductive layer TAB tape may be stacked upon each other to provide additional circuit routing. Further, the TAB tape layers may also be combined with the use of metal foil layers.

Growing community of inventors

Austin, TX, United States of America

John D Geissinger