Intel Corporation

Other

John D Brooks

Manish Chandhok

Jeffery D Bielefeld

Flavio Griggio

Daniel J Zierath

Asad Iqbal

Disclosed herein are integrated circuit (IC) interconnects, as well as related devices and methods. For example, in some embodiments, an interconnect may include a first material and a second material distributed in the first material. A concentration of the second material may be greater proximate to the top surface than proximate to the bottom surface.

Integrated circuit interconnects

A helmet layer is deposited on a plurality of conductive features on a first dielectric layer on a substrate. A second dielectric layer is deposited on a first portion of the helmet layer. An etch stop layer is deposited on a second portion the helmet layer.

Ultra thin helmet dielectric layer for maskless air gap and replacement ILD processes

A game playing apparatus includes a center pole having at least first, second and third nets radially extending therefrom and attached at their ends to end poles. A boundary line extends between the end poles so as to define a circular playing surface divided into three equal area sectors, each sector defining a court for a team. The game is preferably volleyball by which one team competes against the other two teams via conventional volleyball rules. Each team may hit the volleyball over either one of the two nets defining its sector in a manner to preclude return by the other team. The extensible center pole and end poles include collars slidable therealong allowing for adjustment of the net heights. A guide on the center pole indicates a path of initial extension of each net away from the center pole preferably at 120.degree..

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Hillsboro, OR, United States of America

John D Brooks