Infineon Technologies Ag

Infineon Technologies Austria Ag

John Cooper

Stephan Pindl

Joerg Ortner

Prashanth Makaram

Alexander Zoepfl

Martin Mischitz

Michael Knabl

Kae-Horng Wang

Caterina Travan

Horst Kittner

Karl Heinz Gasser

Josef Campidell

Daniel Pieber

Robert Wistrela

Andreas Kitzler

Jakob Simon Dohr

Matic Krivec

An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.

Apparatus having a functional structure delimited by a frame structure and method for producing same

A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.

Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer

Methods, apparatuses and devices relate to inkjet printing a covering layer on at least a first side of a substrate in a peripheral region thereof are discussed.

Inkjet printing in a peripheral region of a substrate

A system and method for prealigning a substrate. One embodiment provides a rotor configured to rotate a carrier around a rotation axis in response to a rotation signal. The carrier includes a main surface substantially perpendicular to the rotation axis. The substrate is disposable on the carrier. The substrate includes a main surface and a mark such that an orientation of the substrate with respect to the rotation axis is detectable. An electromagnetic radiation source is configured to illuminate the main surface of the substrate with electromagnetic radiation. An optical/electrical converter is responsive to the electromagnetic radiation reflected back from the main surface, detecting the mark of the substrate and providing a sensing signal. A controller is configured to receive the sensing signal and providing the rotation signal.

System and method including a prealigner

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Villach, Austria

John Cooper