Nortel Networks Corporation

Northern Telecom Limited

John Clayton Atkinson

Peter Saturley

Marko Nicolici

Jon Bulman-Fleming

Simon John Shearman

Adrianus P Van Gaal

Simon E Shearman

Roger Carroll

Douglas B Cross

Hasler R Hayes

Thomas Charles Currie

Yee-Ning Chan

Amrish Patel

Kalvin W Korpela

Michael H Daniels

Amit Chawla

Richard J Humphreys

Ken McFarlane

A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.

Floating heatsink for removable components

A method and apparatus is disclosed for acoustic noise reduction using fan speed control. The acoustic noise reduction using fan speed control includes a plurality of temperature detectors disposed at a plurality of locations within an electronics equipment enclosure, each detector having an associated setpoint temperature. An error value is determined for each temperature detector, the error consisting of the difference between the detected temperature and the associated setpoint temperature. The maximum error among all error values is then identified and the operating speed of a cooling fan in is set in response to this maximum error. Advantages include providing a fan speed directly related to electronics temperature which inherently accounts for higher ambient temperatures, enclosure altitude, electronics power consumption, and air filter clogging. The acoustic noise reduction using fan speed control is particularly useful for overcoming the need to overcompensate fan speed, thereby resulting in higher than necessary noise levels in order to accommodate worse-case conditions known in the art.

Acoustic noise reduction using fan speed control

A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.

Thermal assembly for cooling an electronics module

A pluggable electronic module is provided that has an electronic component and a module body enclosing the electronic component. The module body has a first surface and a second surface. The first surface has a first area substantially parallel to the second surface and a second area that defines a non-zero angle with respect to the first area. The second area contacts a thermal sink to dissipate heat generated by the electronic component. The pluggable electronic module has a reduced insertion force in comparison with conventional pluggable electronic modules.

Pluggable electronic module

An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.

Extruded heatsink and EMC enclosure

The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface. Further the telecommunications system includes a coolant movement means for moving a coolant through the coolant stream passages and across the rack interface plane. As such, the coolant convects heat away from the cooling surfaces of electronics modules more efficiently and effectively than found in the prior art as it, amongst other things, shortens the distance over which the inlet coolant is required to travel to cool the same functional density and provides a coolant to the passage at approximately a uniform temperature for each module.

Telecommunications system

Circuit pack wherein the electronic components are arranged with high temperature operating components on one side of a PCB and low temperature components on the other side. The PCB acts as a thermal insulator to restrict heat flow from the hot to cooler components. The components on each side of the board are disposed in a vertical connection chimney for heat removal.

Circuit packs and circuit pack and shelf assemblies

Electronic unit in which a printed circuit board is located within a housing which includes a heat sink. The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship. Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases. Preferably the heat conductive efficiency of the compressible member increases as compression increases.

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Ottawa, Canada

John Clayton Atkinson