Digi International Inc.

John Clark Roberts

John Patrick Filoso

Robert Wayne Ridgeway

Paul A Dahl

Michael L Zarns

Travis S Holman

Steven L Minch

A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna.

Embedded coplanar interconnect

A wireless mesh network test system comprises a plurality of mesh network nodes, each comprising an antenna connection. An antenna network couples the antenna connections of the plurality of nodes, and a plurality of attenuators are distributed in the antenna network such that the attenuators simulate distance between the wireless mesh network nodes.

Wireless mesh network node test array

In an example, a method includes aligning a pin of a surface mount module with a corresponding first pin of a header pin assembly of a socket assembly of a circuit board. The first pin includes a first portion configured to electrically couple to the circuit board. A second portion includes a retention feature configured to selectively retain the second portion in engagement with the pin of the surface mount module. The surface mount module is moved in a first direction toward the circuit board, wherein the pin of the surface mount module pushes against the second portion to move the second portion to a second position to allow the pin of the surface mount module to pass by the retention feature. The second portion is configured to move back toward a first position once the pin is moved past the retention feature to engage the pin.

Socket for surface mount module

In an example, an apparatus, such as a header pin, includes an insulator and a first pin disposed at least partially within the insulator. The first pin includes a first portion configured to electrically couple to a circuit board. A second portion is configured to releasably engage a pin of a surface mount module. The second portion includes a retention feature configured to selectively retain the second portion in engagement with the pin of the surface mount module. The second portion is movable between a first position and a second position, wherein the second portion is biased toward the first position. The second portion is movable to the second position to allow the pin of the surface mount module to pass by the retention feature. The second portion is configured to move back toward the first position to engage the pin of the surface mount module.

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Cedar Hills, UT, United States of America

John Clark Roberts