Average Co-Inventor Count = 5.88
ph-index = 7
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Kla Tencor Corporation (11 from 1,787 patents)
2. Kla Corporation (6 from 528 patents)
3. Kla-tencor Technologies Corporation (5 from 641 patents)
4. University of Texas System (1 from 5,444 patents)
23 patents:
1. 12422376 - Imaging reflectometry for inline screening
2. 12332182 - System for automatic diagnostics and monitoring of semiconductor defect die screening performance through overlay of defect and electrical test data
3. 11798827 - Systems and methods for semiconductor adaptive testing using inline defect part average testing
4. 11624775 - Systems and methods for semiconductor defect-guided burn-in and system level tests
5. 11614480 - System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failures
6. 11293970 - Advanced in-line part average testing
7. 10649447 - Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
8. 10466596 - System and method for field-by-field overlay process control using measured and estimated field parameters
9. 10409171 - Overlay control with non-zero offset prediction
10. 9903711 - Feed forward of metrology data in a metrology system
11. 9651943 - Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
12. 9620426 - Method and system for providing process tool correctables using an optimized sampling scheme with smart interpolation
13. 9116442 - Feedforward/feedback litho process control of stress and overlay
14. 8948495 - Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
15. 8804137 - Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capability