Sun Microsystems, Inc.

John Carrillo

Clement Fang

Tayung Wong

Jay C Robinson

Ashok Singhal

Han Y Ko

Nagaraj P Mitty

David Jeffrey

Nikhil Vaidya

A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.

Memory expansion module with stacked memory packages and a serial storage unit

A system and method for storing error correction check words in computer memory modules. Check bits stored in physically adjacent locations within a dynamic random access memory (DRAM) chip are assigned to different check words. By assigning check bits to check words in this manner, multi-bit soft errors resulting from errors in two or more check bits stored in physically adjacent memory locations will appear as single-bit errors to an error correction subsystem. Similarly, the likelihood of multi-bit errors occurring in the same check word may be reduced.

System and method for improving multi-bit error protection in computer memory systems

A memory expansion module including multiple memory banks and a bank control circuit is disclosed. In one embodiment, a memory module includes a printed circuit board with a connector edge adapted for insertion in an expansion socket of a computer system. Mounted upon the circuit board is a plurality of memory chips, typically Dynamic Random Access Memory (DRAM) chips, which make up an upper bank and a lower bank of memory. A buffer circuit is mounted upon the printed circuit board, for the purpose of driving address signals, Column Address Strobe (CAS) signals, and write enable signals to each of the memory chips. Also mounted upon the printed circuit board is a bank control circuit, which is coupled to the memory chips. An address signal is used as a bank selection input to the bank control circuit, which will drive Row Address Strobe (RAS) signals to the memory chips of the selected memory bank. The bank control circuit is further configured to drive RAS signals to both banks simultaneously during CBR (CAS before RAS) refresh operations, which occur when a CAS signal is asserted before a RAS signal.

Memory expansion module including multiple memory banks and a bank control circuit

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San Jose, CA, United States of America

John Carrillo