Texas Instruments Corporation

John Carlo Cruz Molina

Rafael Jose Lizares Guevara

Steffany Ann Lacierda Moreno

Bernard Kaebin Andres Ancheta

Emerson Mamaril Enipin

Ray Fredric Solis De Asis

Julian Carlo Concepcion Barbadillo

In a described example, a method includes: forming cavities in a die mount surface of a package substrate, the cavities extending into the die mount surface of the package substrate at locations corresponding to post connects on a semiconductor die to be flip-chip mounted to the package substrate; placing flux in the cavities; placing solder balls on the flux; and performing a thermal reflow process and melting the solder balls to form solder pads in the cavities on the package substrate.

Flip-chip package assembly

A semiconductor die includes a semiconductor surface including circuitry electrically connected to top-level bond pads exposed on a top surface of the semiconductor die, the top-level bond pads including inner bond pads and outer bond pads positioned beyond the inner bond pads. There is solder on at least the inner bond pads. A ring structure is positioned around a location of at least the inner bond pads.

Semiconductor die with solder restraining wall

In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.

Plated walls defining mold compound cavities

In a described example, an apparatus includes: a package substrate for mounting a semiconductor die to a die side surface, the package substrate including leads spaced from one another; and cavities extending into the leads from the die side surface, the cavities having sides and a bottom surface of the lead material, the cavities at locations corresponding to post connect locations on the semiconductor die.

Flip chip package assembly

A method of making a semiconductor device includes mounting at least two semiconductor dies to a die pad of a leadframe in spaced apart relation to each other, the leadframe having a plurality of preformed leads, electrically connecting each semiconductor die to at least one preformed lead of the leadframe, forming a molding structure including at least part of the semiconductor dies and the preformed leads of the leadframe, and forming a trench in the molding structure in a space between the at least two semiconductor dies, the trench separating the die pad into first and second die pad portions.

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Bataan, Philippines

John Carlo Cruz Molina