Rockwell Automation Technologies Incorporated

John C Teeple

Mark Wilson Eady

Bin Huang

Murray Peter Kingston

Peter Janes

Reginald A Drake

Mark W Eady

An air cooled switching unit for a motor drive includes a plurality electrical switches and a plurality of heat pipe assemblies. Each heat pipe assembly includes a thermally and electrically conductive evaporator, a condenser, and at least one heat pipe extending between the evaporator and condenser. Each of the switches is abutted with an evaporator of at least one of the heat pipe assemblies for conduction of both electrical power and heat between the switch and the evaporator. Each heat pipe assembly further includes an electrically conductive base abutted with the evaporator, and the air cooled switching unit further includes a plurality of power lugs each connected to a base of a respective one of the heat pipe assemblies for input or output of electrical power to the base and the evaporator plate abutted with the base. Each heat pipe assembly includes at least one evaporator defined by a metallic plate. The condenser of each heat pipe assembly includes a plurality of parallel spaced-apart cooling fins. The at least one heat pipe of each heat pipe assembly includes a sealed pipe containing a phase-change material for transferring heat from said evaporator to said condenser. The at least one heat pipe includes a first end located in the metallic plate and a second end in contact with and extending through the cooling fins of the condenser. A temperature feedback system derives air flow velocity through the condenser.

Motor drive with heat pipe air cooling

An apparatus and method for supporting a plurality of components, at least one of which is a heat-generating electrical device such as a power semiconductor device, are disclosed. In some embodiments, the apparatus includes a first structure having a first surface on one side of the structure configured for interfacing a first of the plurality of components and a second surface on another side of the structure, and also includes a second structure capable of receiving the first structure, where one of the second surface and an additional surface of the second structure includes a tip that is in contact with the other of those surfaces. The apparatus further includes at least one component configured to assist in retaining the first and second structures relative to one another, where notwithstanding the at least one component the first structure is capable of pivoting relative to the second structure about the tip.

System and method for supporting one or more heat-generating electrical devices

A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.

Growing community of inventors

Brantford, Canada

John C Teeple