Cabot Microelectronics Corporation

Other

The University of Chicago

Mesodynamics, Inc.

John C Parker

Daniela White

Uthamalingam Balachandran

Yuchun Wang

Michael T Lanagan

Kenneth C Goretta

Renjie Zhou

John Aikens

Suvankar Sengupta

Dean J Miller

Wiechang Jin

Richard W Siegel

Timothy C Perkins

Donglu Shi

Jason Keleher

Jason Aggio

Bin Lu

Jieguang Hu

Elizabeth Remsen

A method of making a nanoporous structure comprising a matrix and at least one nanosized pore within the matrix, wherein the method comprises contacting at least a portion of a templated matrix with an acid solution, wherein the templated matrix comprises a matrix that selected from the group consisting of an organic polymer, a sol-based ceramic, an inorganic salt, an organoaluminate, and combinations thereof, and one or more nanosized templates within the matrix, wherein each nanosized template comprises a core that comprises an inorganic oxide, to dissolve at least a portion of the inorganic oxide of at least one of the cores and form the at least one nanosized pore within the matrix thereby forming the nanoporous structure.

Method of making nanoporous structures

The invention provides a chemical-mechanical polishing composition containing zirconia particles, a modifying agent that adheres to the zirconia particles, an organic acid, and water, as well as a method of using such a polishing composition to polish substrates and a method of using a polishing composition comprising zirconia particles, an organic acid, an oxidizing agent, and water to polishing substrates containing metal and oxide-based dielectric materials.

CMP composition containing zirconia particles and method of use

The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.

CMP compositions containing a soluble peroxometalate complex and methods of use thereof

The invention provides an isolated, particulate polyoxometalate complex comprising a water-soluble cationic polymer and a polyoxometalate compound ionically bound to the cationic polymer. The polyoxometalate compound can be an isopolyoxometalate compound, such as an isopolytungstate, or a heteropolyoxometalate compound. The invention further provides a chemical-mechanical polishing composition comprising a preformed polyoxometalate abrasive, as well as a method of chemically-mechanically polishing a substrate therewith.

Polyoxometalate compositions and methods

The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of an oxidizing agent such as hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises a particulate abrasive (e.g., silica, alumina, and/or titania) suspended in an aqueous carrier containing a ruthenium-coordinating oxidized nitrogen ligand (N&#x2014;O ligand), such as a nitroxide (e.g., 4-hydroxy-TEMPO). In the presence of the oxidizing agent, the N&#x2014;O ligand prevents the deposition of ruthenium species having an oxidation state of IV or higher on the surface of the substrate, and concomitantly forms a soluble Ru(II) N&#x2014;O coordination complex with oxidized ruthenium formed during CMP of the substrate. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.

Ruthenium CMP compositions and methods

The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % &#x3b1;-alumina particles, wherein the &#x3b1;-alumina particles have an average diameter of 200 nm or less, and 80% of the &#x3b1;-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises &#x3b1;-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.

Composition and method for planarizing surfaces

The present invention provides chemical-mechanical polishing (CMP) methods and compositions for polishing copper-containing substrates. The methods of the present invention entail abrading a surface of a copper-containing substrate with a CMP composition of the invention, preferably in the presence of an oxidizing agent (e.g., hydrogen peroxide). The CMP compositions of the invention comprise a particulate abrasive, a copper-complexing agent, a copper-passivating agent bearing an acidic OH group and an additional oxygen substituent in a 1,6 relationship to the acidic OH group, and an aqueous carrier. A preferred composition of the invention comprises about 0.01 to about 1 percent by weight of the particulate abrasive, about 0.1 to about 1 percent by weight of the copper-complexing agent, about 10 to about 1000 ppm of the copper-passivating agent.

Copper-passivating CMP compositions and methods

The invention provides a method of chemically-mechanically polishing a substrate. A substrate is contacted with a polishing pad and a polishing composition comprising an abrasive consisting of (A) particles consisting of titanium dioxide having a rutile structure and (B) particles consisting of titanium dioxide having an anatase structure, wherein an x-ray diffraction pattern of the particles has a ratio of X/Y of about 0.5 or more, wherein X is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.24 &#x212b;, and Y is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.51 &#x212b;, and water. The polishing component is moved relative to the substrate, and at least a portion of the substrate is abraded to polish the substrate.

Low pH barrier slurry based on titanium dioxide

A system for aligning a hub/mast with a soffit penetration point uses an insert that is similar in shape to a terminal adapter that is threadably received within a hub of a meter base. An opening within the insert receives a laser such that when the insert is received within the terminal adapter, the laser beam emitted by the laser, corresponding to the longitudinal axis of the terminal adapter, illuminates the proper penetration point on the soffit of a building from which an electrical conduit holding an electrical conductor should extend.

System for aligning a hub/mast with a soffit penetration point and method of using same

In a high speed injection molding machine the injection 'shot' size is controlled by driving the injection piston by an injection cylinder activated by a precisely known predetermined volume of hydraulic fluid thereby precisely limiting the travel distance of the injection piston during the injection process.

Control for plastic shot volume for a high speed plastic injection

A method of preparing a high temperature superconductor. A method of preparing a superconductor includes providing a powdered high temperature superconductor and a nanophase material. These components are combined to form a solid compacted mass with the material disposed in the polycrystalline high temperature superconductor. This combined mixture is rapidly heated, forming a dispersion of nanophase size particles without a eutectic reaction. These nanophase particles can have a flat plate or columnar type morphology.

Engineered flux-pinning centers in BSCCO TBCCO and YBCO superconductors

A fast cycle plasticator/injector unit for plastic molding machines having a screw type plasticating extruder for feeding thermoplastic material through a sealed fluid flow path to an accumulator which periodically feeds the thermoplastic material through a sealed fluid flow path to an injector that comprises a cylinder with an inlet and an outlet port and a powered piston valve element disposed for reciprocating axial and rotary motion within said cylinder and having a fluid flow channel along a portion of its length in cooperative structural relationship with said inlet port to provide an open fluid flow channel between the inlet port and the charge chamber of said cylinder when the piston is in a first rotational orientation and to block fluid flow from the inlet port to the cylinder when the piston is in a second rotational orientation.

Growing community of inventors

Naperville, IL, United States of America

John C Parker