Agilent Technologies, Inc.

John C Kerley

Steven D Draving

David Eskeldson

A structure and method operable to provide ESD protection for protected circuitry of automatic test equipment (ATE). In a disable mode, the first voltage potential and second voltage potential are substantially equivalent to the reference potential resulting in a clamping circuit providing a nominal clamping voltage to the protected circuit so that an ESD event having a voltage between the first voltage potential and the second voltage potential is shunted to the reference potential via first and second ESD rails, wherein the ESD event is received on a DUT node coupled to the one or more signal rails of the protected circuitry.

Method and structure for AC coupled insitu ESD protection

Disclosed is a system and method for probing target pads in a dense pad array while minimizing distortion of a signal on the pads probed due to the probe load on the target pads and minimizing an amount of cross-talk between aggressor conductors in the dense pad array and the probe tip. In one embodiment, a probe tip arrangement is provided comprising a pad located in a dense pad array and a first probe tip resistor having first and second ends, the first end being coupled to the pad. The first probe tip resistor is positioned directly adjacent to the pad as closely as manufacturing processes will allow. The probe tip arrangement further includes an access transmission line coupled to the second end of the first probe tip resistor and extending outside of the dense pad array to a second probe tip resistor The second probe tip resistor may, in turn, be coupled to an electrical connector which in turn is coupled to a logic analyzer or oscilloscope to test the signal on the respective pad of the pad array.

Split resistor probe and method

An AC signal is switched between two circuit branches using a transformer or at least one directional coupler as a coupling device. Electronically controlled switches shunt one of two terminals of the coupling device to AC ground. The input signal is propagated out of the non-shunted terminal to one of the two circuit branches. The electronically controlled switches may be relays, transistors, or diodes. Diodes prevent the AC signal from being shunted to AC ground when reverse biased and shunt the AC signal to AC ground when forward biased.

Coupling structure as a signal switch

Disclosed is a system and method for probing target pads in a dense pad array while minimizing distortion of a signal on the pads probed due to the probe load on the target pads and minimizing an amount of cross-talk between aggressor conductors in the dense pad array and the probe tip. In one embodiment, a probe tip arrangement is provided comprising a pad located in a dense pad array and a first probe tip resistor having first and second ends, the first end being coupled to the pad. The first probe tip resistor is positioned directly adjacent to the pad as closely as manufacturing processes will allow. The probe tip arrangement further includes an access transmission line coupled to the second end of the first probe tip resistor and extending outside of the dense pad array to a second probe tip resistor. The second probe tip resistor may, in turn, be coupled to an electrical connector which in turn is coupled to a logic analyzer or oscilloscope to test the signal on the respective pad of the pad array.

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Elbert, CO, United States of America

John C Kerley