Intel Corporation

Other

John C Johnson

George S Johnson

Debendra Mallik

Eric J Moret

Sasikanth Manipatruni

Kelin J Kuhn

Lawrence M Palanuk

Gregory A Stone

James G Maveety

Abram M Detofsky

James Edward Neeb

Ian A Young

Aleksandar Aleksov

John Stephen Guzek

Ravindranath Vithal Mahajan

Sairam Agraharam

David Zimmerman

Peter A Davison

Joe F Walczyk

Paul J Diglio

Todd P Albertson

Christopher J Nelson

Nader N Abazarnia

Christopher Wade Ackerman

Clive Leonard Smith

Arnab Choudhury

Darshan Kobla

Jarett L Rinaldi

Akhilesh P Rallabandi

Morten S Jensen

Christopher Roy Schroeder

Phi Hung Thanh

Vimal K Natarajan

Dwight W Kitchin

James R Hastings

Donald E Edenfeld

David Won-jun Song

Alan K Schott

Philip R Martin

Charles Clifton Fulton

Robert W Edmondson

Wei-ming Chi

Kent M Carrie

A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

Conformable heat spreader

Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

System for thermal management of device under test (DUT)

A system includes a processor and a phased array, coupled to the processor, having an arrayed waveguide for acoustic waves to enable directional sound communication.

Integrated acoustic phase array

A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Fluid flow channel for enhanced heat transfer efficiency

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Methods and devices for securing and transporting singulated die in high volume manufacturing

A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

Integrated circuit test temperature control mechanism

A flexible computing fabric and a method of forming thereof. The flexible computing fabric includes an electronic substrate including one or more channels and including at least two ends. At least one computational element is mounted on the electronic substrate between the two ends and at least one functional element is mounted on the electronic substrate between the two ends. The channels form an interconnect between the elements. In addition, the electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.

Flexible computing fabric

Provided are a method and system for using fluid to position a device in a socket for testing. The device is positioned within a socket and a body is coupled to the socket. Fluid is delivered to a chamber defined in part by the body, a first surface of the device to provide pressure onto the device to move the device within the socket.

Using fluid to position a device in a socket for testing

Managing and accessing personal data is described. In one example, an apparatus has an application processor, a memory to store data, a receive and a transmit array coupled to the application processor to receive data to store in the memory and to transmit data stored in the memory through a wireless interface, and an inertial sensor to receive user commands to authorize the processor to receive and transmit data through the receive and transmit array.

Method and apparatus for managing and accessing personal data

A mechanism is described for facilitating and employing a modular processing cell framework according to one embodiment. A method of embodiments may include accepting one or more semiconductor devices in one or more media at a modular processing cell framework ('framework') including a plurality of test cells, moving the one or more semiconductor devices from the one or more media to one or more test cells for testing; and testing the one or more semiconductor devices.

Mechanism for facilitating modular processing cell framework and application for asynchronous parallel singulated semiconductor device handling and testing

A generic data scrambler is provided for a built-in self-test (BIST) engine of a stacked memory device. The stacked memory device includes a memory stack of one or more memory layers; and a system element that is coupled with the memory stack. The system element includes a memory controller for the memory stack; a BIST circuit for testing of the memory stack; and a generic data scrambler for scrambling of data according to a data scrambling algorithm for the memory stack. The generic data scrambler includes a programmable lookup table to hold data factors for each possible outcome of the data scrambling algorithm, and the programmable lookup table is to generate a set of data factors based on addresses of data for testing of the memory stack.

Generic data scrambler for memory circuit test engine

Integrated accoustic phase array

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Phoenix, AZ, United States of America

John C Johnson