Micron Technology Incorporated

John C Fernandez

Craig T Clyne

Tongbi T Jiang

Charles E Larson

Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.

Die attached to a support member by a plurality of adhesive members

Methods of adhering microfeature workpieces, including a chip, to a support member

Microfeature systems including adhered microfeature workpieces and support members

A semiconductor lead frame, a semiconductor package, and a method for fabricating semiconductor packages, are provided. The lead frame includes side rails and multiple patterns of lead fingers. The lead frame also includes die mounting paddles associated with the patterns of lead fingers, and support members that attach the mounting paddles to the side rails. The mounting paddles include stiffening members such as indentations, ridges or corrugations formed in a die mounting surface thereof. The stiffening members prevent bowing of the mounting paddles, provide an increased surface area for bonding dice to the mounting paddles, and allow the mounting paddles to flex to accommodate thermal stresses. The support members for the mounting paddles can also have a stiffening cross sectional configuration to help maintain a planar orientation and location of the mounting paddles. The semiconductor package includes a semiconductor die bonded to a rigidified mounting paddle, and a plastic body encapsulating the die and mounting paddle.

Semiconductor lead frame and package with stiffened mounting paddle

A method and apparatus for monitoring the die attach material adhesive weight in an in-line manner is disclosed. The method and apparatus utilize two weight platforms at pre-dispense and post-dispense positions of an assembly line carrying lead frames. The two platforms weigh the lead frames to obtain pre-dispense and post-dispense weight measurements. These measurements are used by a logic circuit to calculate the weight of the adhesive. The logic circuit upon detection of an inappropriate adhesive weight can sound an alarm, stop the assembly line or automatically adjust a dispenser to administer the appropriate amount of adhesive.

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Boise, ID, United States of America

John C Fernandez