Motorola Corporation

Rockwell Collins, Inc.

Freescale Semiconductor,inc.

John C Estes

Anthony M Pavio

Richard S Kommrusch

Rong-Fong Huang

Lei Zhao

Rodolfo Lucero

William John Thompson

Rong F Huang

Rudolfo Lucero

Rich Kommrusch

An actively tuned filter providing a constant bandwidth at a plurality of frequencies. The filter includes first and second electromagnetically coupled coiled resonators, each resonator having an open end configured to receive an input and a shorted end configured to connect the resonator to a ground. The filter further includes a variable capacitance allowing selection of a capacitance to be applied to the first and second resonators, each variable capacitance being connected to the shorted end of the first and second resonators between the resonator and the ground where the axes of the coils of the first and second resonators are aligned along a single axis.

Actively tuned filter

A tunable filter includes a first resonator; a second resonator; and, a conductive grid assembly electrically coupled to the first and second resonators and coupled to ground. The conductive grid assembly alters the coupling between the first and second resonators. The conductive grid assembly preferably includes a conductive grid element electrically coupled to the first and second resonators; and, a ground coupling element connected between the conductive grid element and ground for altering the coupling between the conductive grid element and ground.

Tunable filter utilizing a conductive grid

An exemplary system and method for providing differential adjustment of the height of a multilayer substrate in localized areas for improved Q-factor performance of RF devices is disclosed as comprising inter alia: a multilayer substrate (); an RF component () embedded in the substrate (); a surface mounted component (); and an RF shield () disposed next to the surface mounted component (), wherein the height of the shield () does not extend substantially beyond the height of the surface mounted component (). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize Q, RF performance and/or material characteristics. Exemplary embodiments of the present invention representatively provide for high-performance, high-quality RF devices that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.

Localized enhancement of multilayer substrate thickness for high Q RF components

A multilayer ceramic structure ( ) includes a first ceramic layer ( ), a second ceramic layer ( ) adjacent to the first ceramic layer, and a transmission line ( ) formed between the first and second ceramic layers. The transmission line includes first and second portions ( ) having a first width, third and fourth portions ( ) formed between the first and second portions and having a second width that is narrower than the first width, and a fifth portion ( ) formed between the third and fourth portions. A probe ( ), comprising a conductively filled via, is attached at one end to the fifth portion, the probe passing through the second ceramic layer for providing a test point ( ). The structure compensates for return loss induced by the probe.

Multilayer ceramic package transmission line probe

A broadband impedance matching integrated circuit apparatus comprising an alternating current ground plane, a direct current ground plane positioned proximate to the alternating current ground plane, a first conductive transmission line positioned a distance from the alternating current and direct current ground planes, a dielectric material layer with a thickness positioned on the first conductive transmission line, a second conductive transmission line positioned on the dielectric material layer wherein the first and second conductive transmission lines are electrically interconnected to behave as an electromagnetically coupled tapped autotransformer.

Broad band impedance matching device with coupled transmission lines

A method of utilizing passive circuit components in an integrated circuit comprising the steps of providing a plurality of integrated capacitive elements and a plurality of integrated inductive elements interconnected to form an electrical circuit wherein each inductive element has a width and creates a circumferential magnetic field. Each integrated inductive element is oriented such that the circumferential magnetic field is parallel to the plane of each adjacent integrated capacitive element and parallel to the width of the integrated inductive element so that the resistance of the electrical circuit is decreased and the quality factor is increased.

Multi-layer integrated circuit structure with reduced magnetic coupling

A stripline integrated circuit apparatus comprising a first ground plane, a stripline section positioned on the first ground plane, the stripline section including N stripline regions where N is a whole number greater than or equal to one, wherein each stripline region includes a stripline sandwiched therebetween a first dielectric layer with a thickness and a second dielectric layer with a thickness where each adjacent stripline is connected in parallel, wherein each adjacent stripline region is separated by a ground plane, a second ground plane positioned on the stripline region, and wherein the plurality of stripline sections are formed and electrically connected in series. The distances between the striplines and the ground planes are adjusted to vary the input and output impedance.

Broad band impedance matching device with reduced line width

A multilayer ceramic integrated circuit module for a receiver front-end of a wireless communication device is provided. The module contains an embedded component portion, which has a plurality of thick film capacitors; a plurality of multilayer capacitors; and a plurality of transmission lines deposited internal to the multilayer ceramic integrated circuit module to interconnect the plurality of thick film capacitors and the plurality of multilayer capacitors. The module also contains a mounted component portion, which has a pair of pin diodes; a transistor and a plurality of resistors coupled thereto, for controlling the bias of the pair of pin diodes; and a low-noise-amplifier. The module reduces the size and weight of wireless devices and combines multiple functions into a highly integrated device.

Integration of a receiver front-end in multilayer ceramic integrated circuit technology

A laminated lowpass filter (100) is disclosed. The filter (100) has: a stack of dielectric substrates (301-312) having a ground via (118); a pi network coupled between an input (202) and an output (202'); a first leg comprising a first transmission line (608) and a first capacitance (C1) connected to a top ground plane (GP1); a second leg comprising a second transmission line (608') and a second capacitance (C2) connected to a bottom ground plane (GP2); a middle leg including a transmission line (606) is between the first and second leg; the single point ground plane configuration prevents ground loops and minimizes the passage of stray signals through the laminated lowpass filter (100).

Multilayer lowpass filter with single point ground plane configuration

What is described is a commonly coupled high frequency transmitting/receiving switching module (100). The switching module (100), has a transmitting circuit (102), a receiving circuit (104), an antenna circuit (106), an external circuit (108), a coupling circuit (110) and control circuits (124, 126). The switching module may be switched between one of four circuit paths (202, 204, 206, 208) each path incorporating an integral harmonic filter (210, 212). This structure is adapted for use in a multi-layer ceramic integrated circuit, and provides the advantage of minimizing current consumption with a minimal number of components.

Growing community of inventors

Tempe, AZ, United States of America

John C Estes