Finisar Corporation

John C Dirkson

Samantha R Bench

Darin James Douma

Rudolf J Hofmeister

Alex Fishman

Konstantinos G Haritos

Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Systems, devices and methods for thermal testing of an optoelectronic module

An electronic assembly tester for testing an electrical component of an optoelectronic device. The electrical component includes a transmit and receive port. The tester includes of a base, an arm, and a hinge. The arm includes a flex circuit and cables. The arm is rotated into a closed position to form a temporary electrical connection between the electrical component and the flex circuit. Other configurations for forming a temporary electrical connection between the test circuit and the electrical component are possible. The electrical component is evaluated by providing a data signal to the transmit portion of the electrical component and evaluating a return data signal obtained from the receive portion of the electrical component.

Electronic assembly tester and method for optoelectronic device

An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.

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Santa Clara, CA, United States of America

John C Dirkson