Rika Electronics International, Inc.

John C Bergeron

John M Winter

Larre H Nelson

Lourie M Sarcione

Stephen A Boyle

A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.

Apparatus for interfacing electronic packages and test equipment

An electrical socket ( ) mounts a plurality of electrical contact probes ( ) for providing an electrical connection between terminals of an electronic package ( ) received in a seat ( ) formed in the socket and respective conductive pads of a DUT board. The contact probes each have a slidable contact tip ( ) which is adapted for engagement with a respective terminal of an electronic package received in the socket and which is removable from the contact probe for ease of replacement. The removable contact tips or plungers are provided with a retainer surface ( ) for interengagement with a removable retainer member of the socket.

Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition

A double-ended, coaxial contact assembly has a center probe rod ( ) mounted in the bore of a dielectric center spacer bushing ( ) and mounts a probe contact assembly on each end of the center probe rod. The center probe rod is received in a ground sleeve ( ) with the probe contact assemblies maintained in coaxial relationship with the ground sleeve by a dielectric outer spacer bushing ( ). In certain embodiments a movable ground plunger ( ) is slidably received in each end of the ground sleeves and biased outwardly by respective ground plunger coil springs ( ). In one such embodiment the center spacer bushing ( &prime;) is provided with an axially extending sleeve disposed between the respective probe contact assembly and the ground sleeve.

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Attleboro, MA, United States of America

John C Bergeron