Motorola Corporation

John C Barron

Gary R Burhance

John K Arledge

Robert B Ford

Henry F Liebman

James A Zollo

Mitchell E Goodman

Peter J Bartels

John Holley

A differential pair () is provided by routing a printed circuit board () having high density interconnect (HDI) substrate () with first and second metal layers () such that a first runner () forms a zigzag pattern using the two metal layers while a second runner () forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

Method and apparatus for routing a differential pair on a printed circuit board

A substrate assembly () and method of making same has at least one embedded component () in a via () of a substrate core () and includes a first adhesive layer () coupled to the substrate core, and a second adhesive layer () on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer () adhered to the bottom surface of the substrate core and a second conductive layer () on the second adhesive layer. The substrate assembly can further include an interconnection () between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening () that at least temporarily exposes at least a conductive surface () of the embedded component.

Circuit board with embedded components and method of manufacture

A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.

Heatsink assembly for a high-power device

Growing community of inventors

Davie, FL, United States of America

John C Barron