St Assembly Test Services Inc.

Advanpack Solutions Pte Ltd.

John Briar

Raymundo M Camenforte

Weddie Pacio Aquien

Setho Sing Fee

Antonio Bambalan Dimaano, Jr

Loreto Ycong Cantillep

Tan Kim Hwee

Roman Perez

Chow Seng Guan

Tong Long Zhang

An Integrated Circuit package structure includes an Integrated Circuit device having a electrical contact points to the device in the bottom surface. A heatsink has a flat bottom surface extending past the device by a first distance and contacting the top surface of the device. A substrate has a flat upper surface extending past the device by the first distance and having points of electrical contact to the device and a lower surface having points of electrical contact for further interconnect of the substrate to surrounding circuitry or components with the upper and lower surfaces extending beyond the bottom surface of the device. A molding compound is between the flat bottom surface of the heatsink and the flat upper surface of the substrate to fill only the first distance and is among the points of electrical contact to the device.

Flip chip molded/exposed die process and package structure

A new method is provided for the establishment of a low resistivity connection between a wire bonded IC chip that is mounted on a heatsink and the heatsink of the package. A copper trace connection is allocated for this purpose on the surface of the substrate layer to which the IC chip is connected. An opening is provided in the substrate layer of the package, this opening aligns with the copper trace that has been allocated for establishing a ground connection and penetrates the substrate layer down to the surface of the underlying heatsink. The opening is filled with a conductive epoxy or an equivalent low-resistivity material thereby establishing a direct electrical connection or short between the allocated copper trace and the underlying heatsink. By connecting the ground point of the IC chip to the allocated copper trace, a direct electrical low resistivity connection is made between the ground point of the IC chip and the heatsink into which the IC chip is mounted.

Enhanced BGA grounded heatsink

A substrate and method of encapsulating a substrate based electronic package using injection molding and a two piece mold is described. The substrate has a barrier material formed on a gating region of the substrate. The barrier material can be formed directly over circuit wiring traces formed on the substrate thereby avoiding restrictions on the location of circuit wiring traces. The barrier material and encapsulant are chosen such that the adhesive force between the barrier material and the encapsulant is greater than the adhesive force between the barrier material and the substrate. When the mold runner is broken away the barrier material is also peeled away without damage to the substrate or circuit wiring traces.

Disposable mold runner gate for substrate based electronic packages

A package is provided for the mounting of IC devices. The IC die is bonded to metal traces contained in a flexible tape, the IC die with the flexible tape is attached to a stiffener (heat spreader), the various heat conducting interfaces are cured and solder balls are attached to another surface of the flexible tape.

Single unit automated assembly of flex enhanced ball grid array packages

A method of assembling a package having an exposed die comprising the following steps. A die attached to a substrate by connectors is provided. The die having a backside. Encapsulate is formed around the die and over the backside of the die to form an encapsulated package. The encapsulate overlying the backside of the die and a portion of the backside of the die are removed using a backside exposure process to complete the assembled package having the die exposed.

Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip

In accordance with the objectives of the invention a new method is provided to insert the underfill for flip-chip semiconductor devices. An IC chip is provided with solder bumps. The flip-chip is entered into an enclosed space, the heatsink forms the top of the enclosed space, the substrate forms the bottom of the enclosed space. The enclosed space is filled with a mold compound. This mold compound now surrounds the IC chip thereby including the area below the IC. The step of inserting the underfill as a separate processing step has thereby been eliminated.

A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A molded stiffener is formed on a flexible tape at the same time molded encapsulation units are formed to encapsulate circuit die which are attached to the flexible tape. The molded stiffeners provide adequate rigidity for processing of the molded flexible circuit assembly. When the stiffeners are no longer needed they are removed at the same time the mold runners are removed. No additional processing steps are required for either the formation or removal of the molded stiffeners.

Molded stiffener for flexible circuit molding

In accordance with the objectives of the invention a new method and apparatus is provide for assuring contact balls coplanarity. The process and apparatus for coplanarity inspection is integrated with the current processing step of BGA device singulation and pick-and-place, thereby eliminating the need for a separate processing step that is typically required for the coplanarity inspection.

Coplanarity inspection at the singulation process

A new method is provided for the conduction of heat between a flip-chip and the motherboard and heatsink onto which the flip-chip is mounted. In a flip-chip package of the invention the heatsink is in direct contact with the flex circuit, the contact balls of the flip chip make contact with the flex circuit. The flip-chip is attached and reflow is performed thereby attaching the contact balls to the flex circuit. The flip chip is encased in a molding compound in a one step process procedure that is in accordance with assigned to a common assignee. The flip-chip is now placed on the motherboard with the contact balls and the underfill facing upwards. The underfill provides direct contact between the flip-chip and the flex circuit/heatsink. This direct contact significantly increases the heat flow between the flip-chip and the heatsink. The top surface of the flip-chip rests, after the flip-chip has been mounted onto the motherboard, on the motherboard thereby providing maximum heat flow between the top of the flip-chip and the motherboard.

Flip chip thermally enhanced ball grid array

A method of fabricating a die-up laminated PBGA package, including the following steps. A mold chase for a PBGA package is provided. The mold chase has an open side with and exposed bottom wall and side walls, and a bottom side. The mold chase is positioned open side up. A heat spreader is dropped into the mold chase open side. The heat spreader has a lower protruding section, and lateral peripheral flanges with gaps therebetween. The protruding section contacts a portion of the bottom wall of the mold chase and the flanges contact a portion of the exposed side walls of the mold chase to thereby secure the heat spreader within the mold chase. A substrate, having a die affixed thereto in a die down position, is fixedly placed over the mold chase. The die being positioned within the space above the protruding section of the heat spreader. A flowable molding compound is applied within the space above the heat spreader and within the space below the heater spreader flanges completely filling these spaces to form a die-up laminated PBGA package. The flowable molding compound is also flowable through the gaps.

Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages

Method of molding flexible circuit with molded stiffener

A new method is provided for the conduction of heat between a flip-chip and the motherboard and heatsink onto which the flip-chip is mounted. In a flip-chip package of the invention the heatsink is in direct contact with the flex circuit, the contact balls of the flip chip make contact with the flex circuit. The flip-chip is attached and reflow is performed thereby attaching the contact balls to the flex circuit. The flip chip is encased in a molding compound in a one step process procedure that is in accordance with Ser. No. 09/640,534, assigned to a common assignee. The flip-chip is now placed on the motherboard with the contact balls and the underfill facing upwards. The underfill provides direct contact between the flip-chip and the flex circuit/heatsink. This direct contact significantly increases the heat flow between the flip-chip and the heatsink. The top surface of the flip-chip rests, after the flip-chip has been mounted onto the motherboard, on the motherboard thereby providing maximum heat flow between the top of the flip-chip and the motherboard.

Growing community of inventors

Singapore, Singapore

John Briar