Corsair Memory, Inc.

Clevx, LLC

John Beekley

Martin Emil Mueller

Andy Paul

Dan Solvin

Don Lieberman

Robert Pearce

Kevin M Conley

Lev M Bolotin

Robert B Hubler

Simon B Johnson

Donald A Lieberman

Daniel R Solvin

James Carlton

Andrew J Paul

Gary Bordenkircher

Power supplied to a memory module is provided. A first voltage is supplied to a first power distribution pathway, the first voltage being from a voltage supplied to a printed circuit board on which the memory module resides. A second voltage is generated, the second voltage being generated by a voltage regulator. The second voltage is supplied to a second power distribution pathway.

Boosting memory module performance

Memory storage device

A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

Thermally enhanced memory module

A method and system for managing memory modules or memory devices is disclosed. The memory modules or memory devices are managed by using a microcontroller on the memory module. A user can remotely control the memory module by sending instructions and data to the microcontroller. The microcontroller can cause the measurement of a number of operational parameters of the memory module. The values of the measured operational parameters can be displayed on a display unit that is attached to the memory module or displayed on a screen associated with the host system.

Managing memory modules

Growing community of inventors

Danville, CA, United States of America

John Beekley