Allegro Microsystems, LLC

Digital Equipment Corporation

John B Sauber

William P Taylor

Paul A David

Shaun D Milano

Shixi Louis Liu

Harianto Wong

Raguvir Kanda

Bruce Hemenway

Richard Dickinson

Jay J Gagnon

Nirmal Sharma

Jason Stauth

Raymond W Engel

Virgil Ararao

Sandra R Pinelle

Elsa Kam-Lum

Ray Engel

John A Kowaleski

Jeffrey G Maggard

In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Packaging for an electronic device

Housing for an electronic device

Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Magnetic field sensors and methods for fabricating the magnetic field sensors

An electronic circuit includes a primary magnetoresistance element for providing a first output signal proportional to a magnetic field. The primary magnetoresistance element has a primary maximum response axis. The primary magnetoresistance element also has a hysteresis characteristic. The electronic circuit also includes a reset conductor disposed proximate to the magnetoresistance element. The electronic circuit also includes a secondary magnetic field sensing element for providing a second output signal proportional to a magnetic field. The secondary magnetic field sensing element has a secondary maximum response axis, which, in some embodiments, is substantially perpendicular to the primary maximum response axis. In operation, the primary magnetoresistance is reset in accordance with an excessive magnetic field sensed by the secondary magnetic field sensing element.

Electronic circuit and method for resetting a magnetoresistance element

An integrated current sensor includes a magnetic field transducer such as a Hall effect sensor, a magnetic core, and an electrical conductor. The conductor includes features for receiving portions of the Hall effect sensor and the core and the elements are dimensioned such that little or no relative movement among the elements is possible.

Integrated current sensor

A semiconductor structure having: semiconductor devices formed in an inner region of a semiconductor chip; a seal ring formed in the chip and disposed about the inner region; and, a plurality of trenches formed along a surface of the chip. The trenches are disposed in a corner region of the chip. A portion of the seal ring is disposed between the trenches and the inner region of the chip. The trenches are disposed along axes oblique to outer edges of the chip. A method is provided for encapsulating a semiconductor chip. The method includes the steps of: providing a semiconductor chip having active semiconductor devices in an inner region of the semiconductor chip and a seal ring in the chip about the inner region; and, forming a plurality of trenches in the chip, a portion of the seal ring being formed between the trenches and the inner region of the chip. A cover is formed having bottom portions in the trenches and on the passivation layer. In particular, the cover is formed by flowing plastic material over the passivation layer and into the trenches to fill such trenches with such plastic material.

Semiconductor structures and packaging methods

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Millbury, MA, United States of America

John B Sauber