Halo Smart Solutions, Inc.

Other

John B Plunkett

Paul Galburt

Frank L Jacovino

David Antar

Mark W Perona

Robert Wilson

Travis Evans

A sensor device, system and method can generate a profile of one or more detected substances in an environment, receive monitoring data from one or more of a group of sensors, and assess whether a heat-not-burn device activity event has been detected. In various embodiments, the sensor device includes a particle detection sensor and a gas detection sensor and a profile for heat-not-burn device activity is established with a threshold of detected particles and/or gases. In various embodiments, the profile for heat-not-burn activity is established with a threshold of gases that is not to be met or exceeded in order to generate a positive heat-not-burn detection.

Heat-not-burn activity detection device, system and method

Embodiments of a sensor device, method and system employ a multiplicity of environmental sensors as a single monitoring and alerting mechanism, operable to provide a profile of any contaminant in terms of various gases and particles in the atmosphere, quantified in terms of relative concentrations. In various embodiments, the sensor device can comprise hardware and firmware elements, including an electronic control system, a case, a shield and a cover. The environmental sensors can be secured as part of the electronic control system and the shield can be formed so as to facilitate proper channeling of air and sound for effective operation.

Sensor device, system and method

Sensor device and system

A set of modules from which custom passive backplanes can be assembled coplanarly couple together and are mounted on a rigid base plate which holds them coupled and coplanar. Each module has a plurality of orthogonally oriented card connectors. Preferably there is a CPU module into which is plugged a CPU card from which an ISA and a PCI originates. On one edge of the CPU module is an connector communicating with the ISA bus. This connector is for chaining together one or more ISA modules, each of which expands the ISA bus to three more ISA connectors. On an opposite edge of the CPU module is an connector communicating with the PCI bus. This connector is for chaining together one or more PCI modules, either 32-bit or 64-bit, each of which expands the PCI bus to three more PCI connectors. Power and ground can be jumpered from module to module or can be directly connected to any module.

Modular backplane

Growing community of inventors

Port Washington, NY, United States of America

John B Plunkett