Rambus Inc.

John B Dillon, Deceased

Donald Victor Perino

James A Gasbarro

Billy Wayne Garrett, Jr

Matthew Murdy Griffin

William Franklin Stonecypher

Michael Tak-Kei Ching

Andy Peng-Pui Chan

An output driver circuit and current control technique to facilitate high-speed buses with low noise is used to interface with high-speed dynamic RAMs (DRAMs). The architecture includes the following components: an input isolation block (120), an analog voltage divider (104), an input comparator (125), a sampling latch (130), a current control counter (115), and a bitwise output driver (output driver A 107 and output driver B 111).

Current control technique

A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.

Integrated circuit package for coupling to a printed circuit board

A socket (14) includes a first bus conductor (22a) having two or more contact regions (24) and a second bus conductor (22b) arranged substantially parallel to the first bus conductor and having two or more contact regions (24). The first and second bus conductors are spaced relative to one another so as to provide a predetermined electrical impedance and may be arranged to carry electrical signals as transmission lines. A dielectric spacer (36) may be disposed between the first and second bus conductors to provide the spacing. Contact regions (24) of the first and second conductors (22a, 22b) may provide compliant coupling regions for the socket (14). The contact regions (24) of the first bus conductor (22a) may be positioned within the socket (14) so as to contact a lead disposed on a first side of a circuit element (16) and the contact regions (24) of the second bus conductor (22b) may be positioned within the socket (14) so as to contact the lead disposed on the second side of the circuit element (16).

Connector with integral transmission line bus

Growing community of inventors

Palo-Alto, CA, United States of America

John B Dillon, Deceased