Dow Corning Corporation

John Albaugh

Adriana Petkova Zambova

Brian Chislea

Eric S Moyer

Russell Keith King

Duane R Bujalski

Kai Su

Craig Rollin Yeakle

Sheng Wang

Katsuya Eguchi

Ronald Paul Boisvert

Gregory Scott Becker

Pierre Maurice Chevalier

Duan Li Ou

Sina Maghsoodi

A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu&#x2014;Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu&#x2014;Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.

Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same

A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.

This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.

Radiation sensitive silicone resin composition

This invention pertains to a siloxane resin composition comprising R SiO siloxane units, R SiO siloxane units and (R O) SiO siloxane units wherein R is an alkyl group having 1 to 5 carbons, hydrogen, or mixtures thereof; R is a monovalent organic group having 6 to 30 carbons; R is a branched alkyl group having 3 to 30 carbons, b is from 1 to 3; and the siloxane resin contains from 2.5 to 85 mole percent R SiO units, 2.5 to 50 mole percent R SiO units and 5 to 95 mole percent (R O) SiO units. The siloxane resin is useful to make insoluble porous resin and insoluble porous coatings. Heating a substrate coated with the siloxane resin at a sufficient temperature effects removal of the R and R O groups to form an insoluble insoluble porous coating having a porosity of 1 to 60 volume percent and a dielectric constant in the range of 1.5 to 3.0.

Siloxane resins

Growing community of inventors

Freeland, MI, United States of America

John Albaugh