Power-one Limited

Other

John Alan Maxwell

Mysore Purushotham Divakar

Thomas H Templeton, Jr

David Keating

Antoin Russell

William T Yeates

Thomas Henry Templeton, Jr

Devices and methods of the present invention are directed to positioning a patient in a prone position that exposes the posterior thoracic lumbar spine during a surgical procedure, such as a laminectomy procedure. The device has at least three support members, with a first support member configured and adapted to support at least a portion of a patient's torso and the patient's hips; a second support member, generally contiguous with the first, configured and adapted to contact a patient's thighs and to position the patient's thighs in a desired angular position relative to the patient's hips and torso; and a third support member, generally contiguous with the second support member, adapted to support a patient's knees and lower legs and to position the patient's lower legs in a desired angular position relative to the patient's torso and thighs. A patient is positioned in the frame device prior to being anesthetized while the patient is lying supine and, during or following administration of anesthesia, the patient (mounted in the device) is rolled onto an operating table and positioned in a prone position. Operation on the posterior thorical-lumbar spine in this position is especially advantageous, and the spinal canal remains virtually bloodless, providing excellent visualization during the surgical procedure. When the surgery is finished, the process is reversed.

Patient positioning frame device and application technique

A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. The heat sink is made with a thermally conductive and electrically insulating polymer compound, such as liquid crystalline polymer or polyphenylene sulfide, which is injection molded to surface of the PCB. The heat sink can be formed on a front side and backside of the PCB and may have a plurality of posts for increasing the heat dissipating surface area of the heat sink. By disposing the heat sink over substantially the entire surface of the PCB, the heat sink is able to remove more heat and allow the power supply module to provide more output load current given the same physical size and ambient conditions.

Integral molded heat sinks on DC-DC converters and power supplies

A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate. High interconnect densities are achieved through the use of a multilayer printed circuit board. This high interconnect density, with the addition of a magnetic core element, allows the power supply packaging system to incorporate transformer windings for an isolation transformer or an inductor.

Power supply packaging system

A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate.

The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

Arrangement for surface mounting of subassemblies on a mother board

A mounting structure for a semiconductor die that reduces die attach strain within the die attach material without sacrificing the electrical and thermal characteristics of the package. In one embodiment, the mounting structure comprises a die attach metallization layer, a solder mask, and a layer of die attach material. The solder mask forms a solder pattern over the top surface of the die attach metallization layer. The solder pattern covers a portion of the die attach metallization layer to create multiple exposed areas of the die attach metallization layer. Each exposed area is separated by the solder mask and is located under the semiconductor die when the semiconductor die is secured to the mounting structure. A layer of die attach material covers the solder pattern and fills in each one of the exposed areas to form a semiconductor die mounting surface. In another embodiment, the die attach metallization layer is divided into multiple, spaced-apart die attach pads that are electrically coupled together. A layer of die attach material covers a portion of each die attach pad and fills in the space between each die attach pad to form a semiconductor die mounting surface. A method of manufacturing the mounting structure is also disclosed.

System and method of reducing die attach stress and strain

A packaging system for a high current, low voltage power supply. The power supply uses two bare die field effect transistors whose input and output electrodes are solder attached to low resistance, high current posts in the package. An associated controller chip is mounted to a rigid circuit board, and the circuit board is mechanically attached to the posts. The circuit board thereby gives physical rigidity to the package, but carries no high currents. The use of low resistance, high current posts reduces the heat generated, improving the long term reliability.

Growing community of inventors

Newbury Park, CA, United States of America

John Alan Maxwell