Heptagon Micro Optics Pte. Ltd.

John A Vidallon

Hartmut Rudmann

Stephan Heimgartner

Jens Geiger

Simon Gubser

Ji Wang

Xu Yi

Susanne Westenhöfer

Kam Wah Leong

Qi Chuan Yu

Thng Chong Kim

Sonja Hanselmann

Christoph Friese

Qichuan Yu

Tobias Senn

Han Nee Ng

Attilio Ferrari

Martin Schubert

Ramon Opeda, Jr

Harmut Rudmann

The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (), wherein the replication tool () comprises a tool material comprising replication sites () comprising a replication surface () each. Each of the replication surfaces () corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features () for reducing asymmetric form errors of the device surfaces. Replication tools () and methods for manufacturing these are also described.

Replication and related methods and devices, in particular for minimizing asymmetric form errors

The method for manufacturing a multitude of devices comprises: And it further comprises, after the conditioning: The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

Method for conditioning a replication tool and related method for manufacturing a multitude of devices

Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Optoelectronic modules that have shielding to reduce light leakage or stray light

Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

Use of vacuum chucks to hold a wafer or wafer sub-stack

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Singapore, Singapore

John A Vidallon