Dow Global Technolgoies LLC

The Dow Chemical Company

Rohm and Haas Company

John A Naumovitz

Mehmet Demirors

Teresa Plumley Karjala

Rajen M Patel

Kumar Nanjundiah

Mohamed Esseghir

Hongyu Chen

Brian W Walther

Yan Huang

Morgan Mark Hughes

David T Gillespie

Yushan Hu

Jeffrey E Bonekamp

Stephen R Betso

Lori L Kardos

Shaofu Wu

Robert L McGee

Mark T Bernius

Lih-Long Chu

Nichole E Nickel

Steven R Jenkins

James L Cooper

Sanjib Biswas

Jose Ortega

Joseph Dooley

Mark J Hall

Mladen Ladika

Douglas S Ginger

Michael H Mazor

Michael B Biscoglio

Carmelo Declet Perez

Frank J Cerk

Zachary L Polk

Chuan Yar Lai

Eric K Lee

Fanny Deplace

Mark G Hofius

Steve R Jenkins

Zhi Xu

Ada Yu Zhang

Jacquelyn A DeGroot

Dibyaranjan Mekap

The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures including one or more layers formed from such blends. In one aspect, a polymer blend includes a copolymer including ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I.sub.2) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer includes 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm.sup.3 or more and having a melt index (I.sub.2) of 20 g/10 minutes or less, wherein the polyolefin includes 1 to 55 weight percent of the blend based on the total weight of the blend.

Polymer blends for use in multilayer structure and multilayer structures comprising the same

An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

Electronic devices comprising two encapsulant films

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resin

A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer composite

A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

Multilayer down-converting encapsulant films and electronic devices including the same

Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5&#xd7;1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation ('PID').

Silane-containing ethylene interpolymer formulation including films and electronic device module comprising same

Electronic device module comprising an ethylene multi-block copolymer

An electronic device module comprising: Typically, the polyolefin copolymer is an ethylene/&#x2200;-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Electronic device module comprising polyolefin copolymer

A method for coextruding a multilayer tubular film having a barrier material comprises (a) extruding a core extrudate of barrier material with a core extruder; (b) providing a preencapsulation die adjacent the outlet of the core extruder, the prencapsulation die capable of producing a non-uniform layer thickness; (c) extruding a preencapsular extrudate of preencapsular material and directing said preencapsular extrudate to the preencapsulation die; (d) joining the core extrudate and the preencapsular extrudate in the preencapsulation die in a coaxial relationship wherein the preencapsular extrudate is disposed radially outwardly of the core extrudate to form a preencapsulated core extrudate having a non-uniform layer thickness; (e) extruding an inner layer extrudate and an outer layer extrudate; (f) feeding the preencapsulated ore extrudate through a distribution manifold to a coextrusion die, the distribution manifold designed to overlap opposing longitudinally extending edges; and (g) forming a multilayer blown film having the inner layer extrudate disposed radially inwardly of the preencapsulated core extrudate and the outer layer extrudate disposed radially outwardly of the preencapsulated core extrudate. In preferred embodiments the inner layer extrudate and the outer layer extrudate are joined to the preencapsulated core extrudate before, or alternatively while, the preencapsulated core extrudate is fed through the coextrusion die.

Method for preparing multilayer films

The present invention is a formulated barrier composition containing tetrasodium pyrophosphate or magnesium hydroxide, high density polyethylene, epoxidzed vegetable oil, oxidized polyolefin and a paraffin or polyolefin wax. The composition has a substantially lower oxygen permeability than existing compositions and is at least equally extrudable.

Formulation for extrudable vinylidene chloride copolymers having high

Growing community of inventors

Midland, MI, United States of America

John A Naumovitz