Honeywell International Inc.

Amphenol Corporation

Other

Honeywell G.m.b.h.

Teradyne, Inc.

John A Lehman

Sepehr Kiani

Richard F Roth

Guangxin Wang

Daniel M Hydock

Bernard S Fritz

Klein L Johnson

Paul Eugene Bauhahn

Joseph James George

David Gessel

Patrick M Hamilton

Lynn M Galarneau

Julian P Bristow

Mark G Vitello

Chung Yi Chou

An optical connector system joining waveguides in two printed circuit boards. A flexible optical conductor is connected at one end to one of the boards. The flexible conductor includes at its free end an alignment structure that provides a separable, low loss interface to an alignment structure coupled to the waveguide on the other board. The ends of the waveguides are enclosed in housings that protect the waveguides from abrasion and contaminates, but expose the waveguides when the connectors mate.

Connector system for optical wave guides

An optical connector system assembled from modular components. These components include connector modules that position ferrules for mating and providing fine alignment to fibers. The modules are assembled to support members to form connectors of various sizes. Mounting modules are attached to the support members. Various shaped mounting modules are provided, allowing connectors to be assembled for various configurations, such as a matrix configuration, a parallel board-to-board configuration or a panel mount configuration.

Flexible optical interconnection system

Optical waveguide assembly

An optical interconnection system, particularly useful in a backplane arrangement in an electronic assembly. The interconnection system includes 'dual-use' protective covers for protection from damage and/or cleaning within backplane and daughter card style connectors. The protective covers are modular for easy use. Some versions contain adhesive members that can remove contaminates from various portions of the connector assembly. The protective covers can be inserted into a backplane connector of an electronic assembly using a tool or as part of a 'dummy board.'

Protective covers for fiber optic connector to modular protective covers for fiber optic connector assembly

The invention encompasses a method and apparatus for producing high-purity metals (such as, for example, high-purity cobalt), and also encompasses the high-purity metals so produced. The method can comprise a combination of electrolysis and ion exchange followed by melting to produce cobalt of a desired purity. The method can result in the production of high-purity cobalt comprising total metallic impurities of less than 50 ppm. Individual elemental impurities of the produced cobalt can be follows: Na and K less than 0.5 ppm each, Fe less than 10 ppm, Ni less than 5 ppm, Cr less than 1 ppm, Ti less than 3 ppm and O less than 450 ppm.

Apparatus for processing metals

A system cleans a set of optical connectors. The system includes a fluid source, a vacuum source, a support member which defines a cleaning device edge, and a set of cleaning devices. Each cleaning device includes (i) a fluid intake member which connects to the fluid source, (ii) a fluid output member which connects to the vacuum source, and (iii) a cleaning head which connects to the fluid intake member and the fluid output member. Each cleaning device is disposed along the cleaning device edge of the support member. The set of cleaning devices is configured to (a) align over a set of optical interfaces of the set of optical connectors, (b) direct fluid (e.g., gas, gaseous snow, etc.) from the fluid source toward the set of optical interfaces, and (c) draw the directed fluid away from the set of optical interfaces and toward the vacuum source.

Methods and apparatus for cleaning optical connectors

The invention encompasses a method and apparatus for producing high-purity metals (such as, for example, high-purity cobalt), and also encompasses the high-purity metals so produced. The method can comprise a combination of electrolysis and ion exchange followed by melting to produce cobalt of a desired purity. The method can result in the production of high-purity cobalt comprising total metallic impurities of less than 50 ppm. Individual elemental impurities of the produced cobalt can be follows: Na and K less than 0.5 ppm each, Fe less than 10 ppm, Ni less than 5 ppm, Cr less than 1 ppm, Ti less than 3 ppm and 0 less than 450 ppm.

Method for processing metals

A device to monitor light output from a light source, including a V-groove substrate with a reflective coating deposited on at least one surface, an optical fiber, a light source positioned so that an amount of the light emitted, which is less than 100%, enters the optical fiber, a light intensity or source detector positioned so that at least some of the light emitted from the light source, that did not enter the optical fiber impinges upon the light intensity detector, and feedback circuitry. A method of producing a device including the steps of coating a surface of a V-groove substrate with a reflective material, placing a light source in said V-groove substrate. A method of producing a device comprising the steps of coating a surface of a V-groove substrate with a reflective material, placing a light source in said V-groove substrate, placing a light intensity detector in said V-groove substrate, and placing a wave guide structure in said V-groove substrate wherein said reflective material, said light source, said detector and said wave guide structure are positioned in said V-groove substrate so that an amount of light emitted from said light source, which is less than 100%, enters said wave guide structure; and at least some of the light emitted from said light source, that did not enter said wave guide structure reflects from said reflective material and impinges upon said light intensity detector.

Laser light sources having integrated detector and intensity control and methods of producing same

A rigid alignment of a fixture connection to a chip having the rigidity of the connection transferred from the chip to a chip holder. The chip has an alignment feature that has a specific position relative to a device on the chip to which another device of a fixture is to be aligned. An alignment fixture has an alignment feature and a device site which aligns with the alignment feature and the device on the chip, respectively. The alignment fixture has a fastener on the chip holder. The chip is moveable on the holder and is moved until the alignment features of the fixture are aligned, which also results in the alignment of the device site with the device. The chip is attached with glue or solder to the holder. The alignment fixture is removed and substituted with a connector interface fixture having no alignment feature relative to the chip but rather an alignment mechanism to the block that the chip is attached. The device and a fastener of the connector interface fixture have the same relative positions as the device site and fastener, respectively, of the alignment fixture. Attaching the fastener of the device fixture to the fastener on the chip holder results in passive alignment of the devices on the fixture and the chip, as the fasteners are likened to an alignment mechanism or features. Stresses applied to the device fixture are transferred to the chip holder via the fastener, and not to the chip. applied to the device fixture are transferred to the chip holder via the fastener, and not to the chip.

Chip-to-interface alignment

The present invention is an optical transmission system comprising an optical source, a first lens and a second lens, a multimode optical waveguide, and a phase-only filter. The optical source generates an optical signal having a predetermined wavelength which is received by the first lens. The signal is then sent from the first lens through the phase-only filter and then to the second lens. The second lens then focuses the signal into the multimode optical waveguide. The multimode optical waveguide has predetermined dimensions and has multiple modes. The phase-only filter excites a plurality of modes in the optical waveguide to approximate equilibrium modal power distribution as the optical signal is received into the optical waveguide.

Growing community of inventors

Bedford, NH, United States of America

John A Lehman