Apple Inc.

Luxvue Technology Corporation

Fujifilm Dimatix, Inc.

Fujifilm Corporation

Dimatix, Inc.

Raster Graphics Inc.

Other

Sportbrain, Inc.

Heidelberger Druckmaschinen Ag

Precision Image Corporation

Fujilfilm Corporation

John A Higginson

Andreas Bibl

Hsin-Hua Hu

Hung-Fai Stephen Law

Kevin Von Essen

Paul A Hoisington

Dariusz Golda

Deane Gardner

Stephen Paul Bathurst

Paul Argus Parks

Jeffrey Birkmeyer

Edward Russell Moynihan

Melvin L Biggs

Robert A Hasenbein

David Albertalli

Nile Alexander Light

Yoshimasa Okamura

Stephen R Deming

Antai Xu

Christoph Menzel

Steven H Barss

Michael J Rocchio

Hyeun-Su Kim

Gregory De Brabander

Steve Deming

Andreas Bibi

Samuel A Lucente

Michael David Nelson

Daniel Alan West

Michele Hickford

Xia Li

Imran Hashim

Kapil Vinod Sakariya

Nobuo Matsumoto

Gene F Day

Tore Nauta

Mats G Ottosson

Norihisa Takada

Don S Minami

Mark Nepomnishy

Gregory DeBrabander

Thomas Charisoulis

Daniel A Cote

Jon A Williams

Sandra J Graveson

Patrick J Czarnota

Alan Menard

David A Swett

Vaibhav D Patel

Kevin C Von Essen

Shenshen Zhao

Micheal Rocchio

Deane A Gardner

Robert Wells

Mats Ottosson

Michael Rocchio

Danielalan West

Gregory De Branbander

Russ Yarp

A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Display and micro device array for transfer to a display substrate

A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

Micro device mass transfer tool

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Light emitting structure

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Micro device transfer head assembly

A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

Micro device stabilization post

Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.

Stacked hybrid micro LED pixel architecture

Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

Apparatus and method for active shape control of a micro pick up array

An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.

Electrostatic cleaning device

Micro device transfer head heater assembly and method of transferring a micro device

Micro LED display

Growing community of inventors

Santa Clara, CA, United States of America

John A Higginson