Western Electric Company, Inc.

John A Emerson

Wesley P Townsend

Donald Dinella

Ted Dennis Polakowski, Jr

Thomas C Dodd

A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

Method of forming a tin-cuprous colloidal wetting sensitizer

It has been discovered that by cleaning a substrate having a negative ink pattern of a desired circuit in a plasma comprising 60/40 oxygen/argon and then sputtering a thin (10-50 Angstroms) layer of catalytic copper thereover, the treated substrate when exposed to an electroless plating bath will selectively plate only in the areas where there is no ink.

Method of selectively depositing a metal on a surface by means of

Method of forming a colloidal wetting sensitizer

A method for depositing a metal on a surface is disclosed. The method comprises coating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal dissolved in a solvent comprising water and an alcohol having a total number of carbon atoms ranging from 2 to 8. The coated surface is treated to reduce the metal salt to metallic nuclei to form a catalytic layer thereon capable of directly catalyzing the deposition of a metal on said nuclei from an electroless metal deposition solution.

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Alexandria, NJ, United States of America

John A Emerson