Intuitive Surgical Operations, Inc.

John A Barton

Jonathan D Halderman

Mathew D Clopp

Derek C Liou

Yves Lacroix

Kierstin Gray Parrish

Theodore W Rogers

Majeed Foad

Viraj Ajit Patwardhan

Rumen Deyanov

Matthew M McConnell

Anqi Fan

Marc Levesque

Quentin F Polosky

John E Sell

Dean A Mansour

Bruce M Schena

Ian E McDowall

David C Shafer

Lyle W Andrich

Diana C W Friedman

Doris Lin

An image capturing device comprises a first elongated body portion formed of a first material and a second elongated body portion coupled to a proximal end of the first body portion. The second body portion is formed of a second material having a greater heat conductivity than the first material. The device further comprises an imaging window coupled to a distal end of the first body portion, a first housing within the first body portion, an image sensor mounted to the first housing, and an image processor mounted to the first housing and coupled to receive electrical signals from the image sensor. The device further comprises a second housing within the first body portion. The second housing is coupled to the first housing and to the window such that heat generated by the image sensor and image processor is transmitted through the second housing to the window.

Image capture device with reduced fogging

An exemplary system includes a memory storing instructions and a processor communicatively coupled to the memory. The processor is configured to execute the instructions to receive, from a sensor of a surgical instrument, environmental condition information associated with the surgical instrument and detected by the sensor while the surgical instrument is disconnected from an external power source, the surgical instrument including circuitry configured to be powered and operate only while the surgical instrument is connected to the external power source, determine, based on the environmental condition information, an operational condition of the surgical instrument, and provide a notification indicating the determined operational condition of the surgical instrument.

Surgical instruments and systems and methods for determining condition information thereof

A method includes forming, by atomic layer deposition, a first barrier layer on a surface of a printed circuit board ('PCB') and on an outer surface of an electrical component attached to the surface of the PCB; forming an adhesion promotion layer on a surface of the first barrier layer; and forming, on the adhesion promotion layer, a second barrier layer including Parylene.

Electronic assemblies including a conformal moisture barrier

An illustrative system includes first and second electrical circuits, a free space optics interface assembly, and a feedthrough assembly. The free space optics interface assembly may include an optical transmitter having an input that is electrically coupled to the first electrical circuit, and an optical receiver having an output that is electrically coupled to the second electrical circuit. The feedthrough assembly electrically connects the input of the optical transmitter to the first electrical circuit and includes a first conductive receptacle electrically coupled to a first input pin of the optical transmitter, a second conductive receptacle electrically coupled to a second input pin of the optical transmitter, a first conductive pad providing electrical connection of the first input pin of the optical transmitter to the first electrical circuit, and a second conductive pad providing electrical connection of the second input pin of the optical transmitter to the first electrical circuit.

Systems and methods for high-speed data transmission across an electrical isolation barrier

An illustrative system may include a radio frequency ('RF') transmitter electrically coupled to a first electrical circuit and electrically isolated from a second electrical circuit; an RF receiver having a top surface that is parallel with a top surface of the RF transmitter, the RF receiver electrically coupled to the second electrical circuit and electrically isolated from the first electrical circuit; and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of data between the RF transmitter and the RF receiver, the data provided by the first electrical circuit, the waveguide comprising an input port that at least partially covers the top surface of the RF transmitter, and an output port that at least partially covers the top surface of the RF receiver.

An image capture unit has mounted in a frame: a first imaging assembly, a first circuit board, a second imaging assembly, and a second circuit board. The first imaging assembly is mounted on the first circuit board. The second imaging assembly is mounted on the second circuit board. A portion of the first circuit board and a portion of the second circuit board have a stacked configuration with the portion of the first circuit board being approximately parallel to the portion of the second circuit board. An end of another portion of the first circuit board is adjacent to an end of another portion of the second circuit board.

Compact stereoscopic image capture unit

A system and method for a teleoperational medical system is provided is provided that can include one or more processors, conductors can extend through a shaft with an interface positioned at a proximal end of the shaft and a sensor(s) positioned at a distal end of the shaft, and the conductors can electrically couple the sensor(s) to the processor via the interface. Signals can be transmitted over the conductors between the sensor(s) and the processor(s). The signals can include power and control signals transmitted in one direction over the conductors and sensor data transmitted in an opposite direction over the same conductors.

Systems and methods for communicating over a reduced number of conductors in a teleoperational system

An electronic assembly includes a printed circuit board ('PCB'), an electrical component attached to a surface of the PCB, and a conformal barrier disposed on at least a portion of the surface of the PCB and on an outer surface of the electrical component. The conformal barrier includes a first barrier layer including an atomic layer deposited film and a second barrier layer including Parylene.

An exemplary medical system includes a first electrical circuit (-) on a PCB (), a second electrical circuit (-) on the PCB and electrically isolated from the first electrical circuit, and a free space optics interface assembly () on the PCB. The free space optics assembly includes a housing () defining a free space chamber () in the housing, an optical transmitter () having an input () that is electrically coupled to the first electrical circuit, and an optical receiver () in optical communication with the optical transmitter via the free space chamber and having an output () that is electrically coupled to the second electrical circuit. The optical transmitter and the optical receiver are hermetically sealed within the housing.

An exemplary medical system includes a first electrical circuit on a printed circuit board (PCB) and configured to generate data, a second electrical circuit on the PCB and electrically isolated from the first electrical circuit, and a radio frequency (RF) communication interface assembly on the PCB. The RF communication interface assembly includes an RF transmitter electrically coupled to the first electrical circuit and electrically isolated from the second electrical circuit, an RF receiver out of direct RF signal path alignment with the RF transmitter, electrically coupled to the second electrical circuit, and electrically isolated from the first electrical circuit, and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of the data between the RF transmitter and the RF receiver.

An image capturing device comprises an elongated body, an imaging window coupled to a distal end of the elongated body, and a heat source within the elongated body. The heat source is configured to apply heat to the imaging window to remove condensation from or prevent condensation from forming on the imaging window.

An image capture device includes a plurality of stacked ceramic circuit boards, an image sensor, signal conditioning electronics, and a connector. Each ceramic circuit board is parallel and directly coupled to at least one other circuit board. The image sensor is mounted to a first ceramic circuit board. The signal conditioning electronics are mounted to one or more of the stacked ceramic circuit boards and are coupled to receive electrical signals generated by the image sensor. The image capture device is enclosed by a shaft and the stacked ceramic circuit boards are stacked along a length of the shaft. The connector is mounted to a second ceramic circuit board that is on an opposite side of the plurality of stacked ceramic circuit boards from the first ceramic circuit board. The connector is mounted to a side of the second ceramic circuit board facing away from the first ceramic circuit board.

Compact binocular image capture device

A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

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Mountain View, CA, United States of America

John A Barton