Rogers Germany Gmbh

Trumpf Photonics, Inc.

Johannes Wiesend

Andreas Meyer

Stefan Britting

Karsten Schmidt

Thilo Vethake

Vitalij Gil

Heiko Schweiger

Nico Kuhn

Manfred Götz

Michael Macher

A cooling device () for cooling an electrical component (), in particular a laser diode, including

Cooling device for cooling an electrical component and method for producing a cooling device

An adapter element () for connecting a component (), such as a laser diode, to a heat sink (), comprising: a first metal layer (), which in a mounted state faces the component (), and a second metal layer (), which in the mounted state faces the heat sink (), and an intermediate layer () comprising ceramic arranged between the first metal layer () and the second metal layer (), wherein the first metal layer () and/or the second metal layer () is thicker than 40 &#x3bc;m, preferably thicker than 70 &#x3bc;m and more preferably thicker than 100 &#x3bc;m.

Adapter element for connecting a component, such as a laser diode, to a heat sink, a system comprising a laser diode, a heat sink and an adapter element and method for producing an adapter element

Growing community of inventors

Speinshart, Germany

Johannes Wiesend