Infineon Technologies Ag

Johannes Uhlig

Ulrich Nolten

Arthur Unrau

Marco Ludwig

Regina Nottelmann

Jens Krugmann

Sven Hagebusch

Achim Mücke

A housing for a power semiconductor module arrangement includes sidewalls and a lid. The lid includes a first layer of a first material having a plurality of openings, and second layer of a second material that is different from the first material. The second layer completely covers a bottom surface of the first layer. The second layer includes a plurality of protrusions, each protrusion extending into a different one of the plurality of openings of the first layer such that each of the plurality of openings is completely covered by one of the protrusions.

Housing, semiconductor module and methods for producing the same

A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.

Module with gas flow-inhibiting sealing at module interface to mounting base

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Soest, Germany

Johannes Uhlig