Kulicke and Soffa Die Bonding Gmbh

Johannes Schuster

Michael P Schmidt-Lange

Kam-Shing Wong

A pick tool for picking a planar object from a supply station is presented, in particular to be used for picking a semiconductor die from a carrier tape, said pick tool comprising: a work surface, said work surface comprising at least one contact region that may be brought into contact with a first surface on a first side of the planar object; one or more vacuum outlets in the work surface that may be connected to a vacuum source to allow for temporarily fixing the planar object to the work surface; and wherein a flexible seal is provided to maintain vacuum if the planar object becomes deformed.

Tool for picking a planar object from a supply station

An apparatus () for fixing a planar object, in particular a substrate (), on a working area () by means of vacuum is provided with an at least partly transparent bearing plate (), one side of which forms the working area and which has a rear side arranged at a distance from the working area with a radiation-reflecting structure (). The bearing plate additionally has vacuum channels which can be connected to a vacuum line and which open into the working area. In order to illuminate the substrate as homogeneously as possible by means of transmitted light, at least one light source () is provided, the radiation of which can be fed into the bearing plate. In addition, the working area is preferably operatively connected to a heating apparatus (), so that the substrate () can be heated.

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Kreuzlingen, Switzerland

Johannes Schuster