U.S. Philips Corporation

Johannes P Van Dooren

Johan Bosman

Willem Hoving

A method of adjusting the mutual separation (g) of the two overlapping metallic cantilever members (9, 11) within the vitreous envelope of a reed switch, having a beam (21) of radiant energy to which the envelope is substantially transparent directed for a controlled period of time through the envelope onto a localised area (p) of at least one of the members (11), causing permanent thermally-induced bending of that member (11) about the irradiated area (p).

Method of laser adjusting the switch-gap in a reed switch

A method of selectively removing a metallic layer (3) from a non-metallic substrate (1) includes the steps of arranging for the metallic layer (3) to be overlaid by a coating (7) of Sn-rich metallic material, and directing a laser beam of wavelength .lambda. onto a selected area (5') of the coating (7), .lambda. being chosen to lie in the range 450-650 nm, thereby causing localized heating of the coating (7) in this area (5') and consequent ablative removal of the underlying portion of the metallic layer (3). The method is particularly useful in the manufacture of printed circuit boards.

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Eindhoven, Netherlands

Johannes P Van Dooren