Besi Netherlands B.v.

Fico B.v.

Johannes Lambertus Gerardus Maria Venrooij

Adrianus Henricus Ignatius Maria Verkuijlen

Marcel Gerardus Antonius Tomassen

Albertus Franciscus Gerardus Van Driel

Henricus Antonius Maria Fierkens

Jeroen Kleijburg

Jan Roelofsen

Wilhelmus Gerardus Joseph Gal

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

Method and mould for encapsulating electronic components mounted on a carrier

The present invention relates to a handler device for handling substrates during semiconductor production, comprising a handling unit having a substrate facing side to be directed to the substrate to be handled, said handling unit being provided with at least three substrate edge grippers protruding from the substrate facing side of the handling unit. The substrate edge grippers are configured to grip the edge of a substrate to be handled, wherein the at least three substrate edge grippers comprise: at least two controlled moveable positioning grippers for gripping the edge of the substrate at two controlled positions and at least one clamping gripper for exerting a controlled clamping force onto the edge of the substrate at least partially directed towards the positioning grippers. The handler further comprises individually controllable actuators connected to the handling unit for independent control of each of the controlled moveable positioning grippers.

Handler device for handling substrates

A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.

Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product

The invention relates to a modular system for moulding electronic components, comprising at least three separate system modules; a press module for moulding the electronic components; a loader module for loading the electronic components to be moulded from a cassette to a press module; and a service module configured to at least partially control each of the other system modules. The invention also relates to a kit-of-parts for assembling such a modular system.

Modular system for moulding electronic components and kit-of-parts for assembling such a modular system

The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed () and a first fluid feed () whereby their connection can be interrupted by a displacer (). In a further embodiment a displacer () is provided in the feed channel () to place the encapsulating material () under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.

Press with plate-like frame parts, and method for operating such a plate press

The invention relates to an apparatus for processing electronic components, such as semi-conductor products, comprising at least two processing stations, at least one supply/discharge position for electronic components, a robot arm with engaging means for engaging the electronic components for displacing electronic components between the supply/discharge position and the processing stations, and a control for actuating the robot arm and the processing stations. The invention also relates to an assembly of at least two such apparatuses and to a method for processing electronic components which can be performed by means of the apparatus according to the invention.

Apparatus and method for processing electronic components

The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.

Growing community of inventors

Duiven, Netherlands

Johannes Lambertus Gerardus Maria Venrooij