Semikron Elektronik Gmbh &co.kg

Semikron Danfoss Elektronik Gmbh & Co., Kg

Johannes Klier

Roland Bittner

Sandro Bulovic

Alexander Wehner

Peter Lemke

Markus Beck

Markus Müller

Thomas Götze

Christian Zeiler

Bernd Fischer

A power semiconductor module has a substrate that has an electrically non-conductive insulating layer and a first metal layer on the insulating layer and forms conductor tracks, with power semiconductor components arranged on the first metal layer and electrically connected to the first metal layer and having a DC voltage connection device that has a first, second and third flat conductor connection element that are arranged on an end region of the power semiconductor module and that are electrically conductively connected to the first metal layer. During operation, the first and second flat conductor connection elements have a first electrical polarity and the third flat conductor connection element has a second electrical polarity.

Power semiconductor module having a substrate, power semiconductor components and having a DC voltage connection device

Load bridges () of an inverter unit () include load branches having semiconductor switches (), that have a node point () which is connected to a load () and to two different potentials (P, P). Node points () are connected via a first resistance circuit () to potential (P). Node points () are further connected via second resistance circuits () to tap-off points (). The tap-off points () are connected via third resistance circuits () to the other potential (P). At each of the tap-off points (), a potential (U, U, U) is tapped-off and is fed to a monitoring device (). The monitoring device () determines the difference (U') between the tapped-off potentials and the second potential (P). The control device () considers the signals (M, M, M) for the actuation of the load bridges ().

Inverter unit with detection of voltage drops on semiconductor switches

A power electronic assembly with a housing and a capacitor device therein. The capacitor device has capacitor elements, each with a first and a second capacitor contact device, and a capacitor busbar having a first metal shaped body with a first contact point and a second metal shaped body with a second contact point. The first metal shaped body of first polarity has a plurality of first terminal contact devices each connected to a first capacitor contact device and the second metal shaped body of second polarity has a plurality of second terminal contact devices each connected to a second capacitor contact device. The individual current paths each formed from a first partial current path between the first contact point and a first terminal contact device and a second partial current path between the second terminal contact device associated with the first and the second contact point each have the same current path length.

Power electronic assembly with a housing and with a capacitor device arranged therein

A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Power semiconductor arrangement having a cover facility and method for releasing it

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

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Amberg, Germany

Johannes Klier