Nxp B.v.

Nxp Usa, Inc.

Johannes Cobussen

Antonius Hendrikus Jozef Kamphuis

Guido Albermann

Ernst Eiper

Chantal Claude Dijkstra

Christian Zenz

Leendertjan Mekking

Speed of plasma etching is regulated in regions prone to over-etching by providing an etch resistant structure, such as a metal saw bow, in the region. By adjusting dimensions, such as the length and width of the saw bow legs and an area defined by the saw bow legs, as well as a shape of the etch region through techniques such as chamfering, plasma etch speed in the region can be controlled with an intent to match the speed of etching in non-over-etched regions.

Method and system for regulating plasma dicing rates

A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

Technique for handling diced wafers of integrated circuits

A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.

Optical control modules for integrated circuit device patterning and reticles and methods including the same. The methods include exposing, via a reticle, initial and subsequent reticle exposure fields on a surface of a semiconductor substrate. The initial and subsequent reticle exposure fields pattern corresponding array regions and margin regions on the semiconductor substrate. The initial and subsequent reticle exposure fields partially overlap such that an initial optical control module (OCM), which is patterned during exposure of the initial reticle exposure field, and a subsequent OCM, which is patterned during exposure of the subsequent reticle exposure field, both are positioned within a single control module die. The reticles include reticles that can be utilized during the methods or that can form the integrated circuit devices. The integrated circuit devices include integrated circuit devices formed utilizing the methods or the reticles.

Optical control modules for integrated circuit device patterning and reticles and methods including the same

A saw bow is provided and designed such that the conductors of the saw bow will break at a predictable location when using modern dicing techniques. This results in a break in the circuit provided by the saw bow, with any exposed conductors not being on the die side. Further, by providing a known breaking point in the saw bow, modern dicing techniques such as plasma dicing can be used, thereby allowing for the saw lane to be made narrower, which will in turn increase the number of wafers that can be included on a wafer.

Growing community of inventors

Beuningen, Netherlands

Johannes Cobussen