Robert Boschgmbh

Johannes Classen

Lars Tebje

Jochen Reinmuth

Daniel Christoph Meisel

Burkhard Kuhlmann

Joerg Hauer

Udo-Martin Gomez

Arnd Kaelberer

Axel Franke

Jens Frey

Torsten Ohms

Mirko Hattass

Reinhard Neul

Kersten Kehr

Christoph Lang

Wolfram Bauer

Rainer Willig

Patrick Wellner

Heribert Weber

Oliver Kohn

Dietrich Schubert

Guenther-Nino-Carlo Ullrich

Sebastian Guenther

Christoph Gauger

Michael Veith

Antoine Puygranier

Christoph Schelling

Frank Fischer

Rolf Scheben

Jochen Franz

Thorsten Balslink

Christian Doering

Ralf Reichenbach

Udo Bischof

Mathias Reimann

Amin Jemili

Denis Gugel

Rudy Eid

Timm Hoehr

Markus Linck-Lescanne

Dieter Maurer

Cristian Nagel

Ermin Esch

Christian Bierhoff

Joerg Braeuer

Matthias Meier

Hans-Dieter Schwarz

Hubert Benzel

Hans Artmann

Heiko Stahl

Andrea Visconti

Alexander Buhmann

Marian Keck

Julian Gonska

Torsten Kramer

Achim Breitling

Andreas Scheurle

Ralf Noltemeyer

Hendrik Specht

Daniel Meisel

Robert Sattler

Paul Farber

Ruslan Khalilyulin

Timo Giesselmann

Markus Heitz

Falk Roewer

Fouad Bennini

Benny Pekka Herzogenrath

Hans-Joerg Faisst

Wolfram Geiger

Martin Wrede

Christof Schwenk

Carsten Geckeler

Michael Saettler

Peter Sudy

Sebastian Gracki

Gregor Wetekam

Jan-Peter Stadler

Manuel Dietrich

Holger Rumpf

Jochen Hahn

Marco Quander

Pia Bustian-Todorov

Harald Steffes

Holger Rank

Ramona Maas

Simon Genter

Buckhard Kuhlmann

Frank Reuss

Artjom Kosov

Istvan Kadar-Nemet

Johannes Seelhorst

A contact lens. The contact lens comprises an acceleration sensor for detecting a structure-borne sound produced by a wearer of the contact lens.

Contact lens, method for detecting a structure-borne sound with the aid of a contact lens, method for producing a contact lens

A sensor system including a chip arrangement, the chip arrangement including a sensor and an acceleration sensor, and the sensor system including a processor circuit. The processor circuit is configured in such a way that: one or multiple temperature-dependent variables and/or properties of the sensor are ascertained, and an offset of a signal of the acceleration sensor induced by a temperature gradient is corrected with the aid of the one or the multiple ascertained temperature-dependent variables and/or properties of the sensor.

Sensor system, method for operating a sensor system

A micromechanical component, in particular, an inertial sensor, including a seismic mass, a substrate, and a cap. The component includes a reference electrode, which is in a first electrode layer and is connected to the substrate, and a further reference electrode, which is in a second electrode layer and is connected to the cap. The seismic mass is deflectable on two sides, in a direction perpendicular to the major plane of extension of the reference electrode. The seismic mass includes a flexible limit stop in the direction of deflection towards the first electrode layer. The flexible limit stop is connected to the main part of the seismic mass using a spring element. The spring element is in an elastic layer, which is positioned between a layer of the main part of the seismic mass and the first electrode layer.

Micromechanical component, in particular, inertial sensor, including a seismic mass, a substrate, and a cap

A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

Micromechanical component for a pressure and inertial sensor device

A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.

Micromechanical sensor device and corresponding production method

A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.

Micromechanical system, method for operating a micromechanical system

A coupling of two electronic apparatuses for a wireless information exchange. The coupling is authenticated through the evaluation of motion patterns previously executed by the apparatuses.

Electronic apparatus, system for wireless information exchange, and method for coupling two apparatuses

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Micromechanical structure and micromechanical sensor

A micromechanical sensor, including a micromechanical chip having a first micromechanical structure, a first evaluation chip, having a first application-specific integrated circuit, and a second evaluation chip having a second application-specific integrated circuit. The first evaluation chip and the micromechanical chip are situated in a stacked manner, the micromechanical chip being directly electrically conductively connected with the first evaluation chip and the first evaluation chip being directly electrically conductively connected with the second evaluation chip. The first application-specific integrated circuit primarily includes analog circuit elements and the second application-specific circuit primarily includes digital circuit elements.

Micromechanical sensor

A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Micromechanical device including a stop spring structure

A manufacturing method for a micromechanical component. The method includes: providing an ASIC component including first front and rear sides, a strip conductor unit being provided at the first front side; providing a MEMS component including second front and rear sides, a micromechanical functional element situated in a cavity at the second front side; bonding the first front side onto the second front side; back-thinning the first rear side; forming vias starting from the back-thinned first rear side and from a redistribution unit on the first rear side, the vias electrically connecting the strip conductor unit to the redistribution unit; forming electrical contact elements on the redistribution unit; and back-thinning the second rear side. The back-thinning of the first and second rear side taking place so that a thickness of the stack made up of ASIC component and MEMS component is less than 300 micrometers.

Manufacturing method for a micromechanical component, a corresponding micromechanical component and a corresponding configuration

A micromechanical component for a sensor device including a substrate having a substrate surface, at least one stator electrode situated on the substrate surface and/or on the at least one intermediate layer covering at least partially the substrate surface, which is formed in each case from a first semiconductor and/or metal layer, at least one adjustably situated actuator electrode, which is formed in each case from a second semiconductor and/or metal layer, and a diaphragm spanning the at least one stator electrode and the at least one actuator electrode, including a diaphragm exterior side directed away from the at least one stator electrode, which is formed from a third semiconductor and/or metal layer, a stiffening and/or protective structure protruding at the diaphragm exterior side being formed from a fourth semiconductor and/or metal layer.

Micromechanical component for a sensor device and manufacturing method for a micromechanical component for a sensor device

A micromechanical sensor system, in particular, an acceleration sensor, including a substrate having a main extension plane, the sensor system including a first mass and a second mass. The first and second masses are each designed to be at least partially movable in a vertical direction, perpendicular to the main extension plane of the substrate. The first mass includes a stop structure, wherein the stop structure has an overlap with the second mass in the vertical direction.

Micromechanical sensor system, method for using a micromechanical sensor system

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

Micromechanical component and method for manufacturing a micromechanical component

A sensor system including a plurality of individual and separate sensor elements. Each of the individual sensor elements is independently functional. The individual sensor elements of the sensor system being formed in one piece from parts of a wafer or a vertically integrated wafer stack. The sensor system including at least one separation structure, in particular a scribe line, between the individual and separate sensor elements.

Sensor system, including a plurality of individual and separate sensor elements

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Reutlingen, Germany

Johannes Classen