'3p' Licensing B.v.

&ldquo;3p&rdquo; Licensing B.v.

Johannes Bernardus Petrus Janssen

Johannes Bernardus De Vrught

A method for manufacturing encapsulated electronic components, particularly integrated circuits, includes the steps of: a) attaching electronic components on a first side of a lead frame and electrically connecting the electronic components to the lead frame; b) using a mould to encapsulate the electronic components with an encapsulating material on just a first side of the lead frame, while a second side of the lead frame is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, individual encapsulated electronic components. The bonding of the adhesive film to the second side to be shielded of the lead frame takes place between step a) and step b).

Method for manufacturing encapsulated electronic components, particularly integrated circuits

A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mold to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).

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Malden, Netherlands

Johannes Bernardus Petrus Janssen