Koninklijke Philips Corporation N.v.

U.S. Philips Corporation

Philips Lighting Holding B.v.

Johannes Alexander Rebergen

Volker Thor

Siebe Tjerk De Zwart

Johannes Wilhelmus Weekamp

Theodoor Cornelis Treurniet

Peter Sommerfeld

Ruslan Akhmedovich Sepkhanov

Piet C Van Rens

Vincent S D Gielen

Arnold Buijs

Theodoor C Treueniet

Renatus W C Van Der Veeken

Godfried C G M Manders

Willem Van Der Hoeck

Arjan De Winter

A circuit board () for carrying at least one light source () of a lighting device and a method of manufacturing such a circuit board are provided. The circuit board comprises a substrate (), wherein the substrate comprises at least one fold () forming a projecting portion and extending from a periphery () of the substrate up to an inner portion () of the substrate, whereby the substrate has a polygonal funnel shape. The present aspects use the concept of folding the substrate in order to obtain a polygonal funnel shape of the circuit board, whereby shaping of the substrate without requiring removal of material of the substrate is allowed.

Circuit board comprising at least one fold

A cooling arrangement comprising a source electrode, a first and a second target electrode arranged at a distance from the source electrode and control circuitry for controlling a voltage being applied between the source electrode and at least one of the first and the second target electrodes. The voltage is controlled such that an airflow resulting from a potential difference between the source electrode and at least one of the first and the second target electrodes is arranged to have alternating directions. By means of the invention it may be possible to provide cooling of a device having similar or better performances than a conventional heat sink and fan system, but with a smaller size and weight as well as being silent.

Cooling arrangement for a luminaire

An arrangement for heat dissipation for a heat generating electrical component () comprising a heat generating electrical component () arranged on the printed circuit board (), in thermal contact with a thermally conductive layer () of the PCB. A thermally conductive mounting element () is attached to the thermally conductive layer () by means of soldering, and has a connecting portion () adapted to engage with a recess () in the heat sink (); thereby enabling attachment of the printed circuit board () to the heat sink (); wherein a thermal path is provided, from the heat generating electrical component (), via the thermally conductive layer () and the mounting element (), to the heat sink (). By utilizing a thermally conductive mounting element, heat dissipation can be achieved with a PCB provided with a single thermally conductive layer, rather than the multi layer PCB required in prior art arrangements. As no screws and/or adhesives are used to attached the PCB to the heat sink, the PCB may easily be removed, and the problem of bending caused by differences in coefficient of thermal expansion is overcome.

Thermally conductive mounting element for attachment of printed circuit board to heat sink

A rectifier device for a three-phase dynamo of motor vehicles has a cooling body, with at least one circuit carrier arranged on the cooling body and having a surface with an electrically conductive structure, having at least a first diode which is arranged on the electrically conductive structure of the surface of a circuit carrier and which is designed to rectify a first half wave, and having at least a second diode arranged on the cooling body and designed to rectify a second half wave.

Rectifier device, having a cooling body, for a three-phase dynamo of a motor vehicle

A rectifier device with at least one cooling body), with at least one diode arranged on the cooling body, with at least one protective layer is arranged on the diode and the cooling body, and with at least one receptacle at the cooling body for connection to the protective layer.

Rectifier device for a dynamo of a motor vehicle

In an electron tube having a glass envelope portion (1) is an electrode system (3) which is slid in the envelope portion (1) and is centered with respect to the wall (7) of the envelope portion (1) by means of a number of pretensioned springs (6). The springs (6) each extend from a supporting point B, which is fixed with respect to the electrode system (3), over their effective spring length toward the wall (7) of the envelope portion (1) and press against the wall (7) at a contact point A. A stick-slip movement of the springs over the surface of the wall (7) during the sliding movement of the electrode system (3) is avoided because the springs (6) each extend over their effective spring length along a straight line between supporting point B and contact point A. Flowing of the springs and the resulting occurrence of glass damage to the wall (7) is minimized by this spring configuration.

Electron tube with electrode centering arrangement

Growing community of inventors

Eindhoven, Netherlands

Johannes Alexander Rebergen