Motorola Corporation

Other

E.i. Dupont De Nemours and Company

Dupont Displays Inc

Johann T Trujillo

Chenggang Xie

Rodolfo Lucero

Andrew Wesley Johnson

Dmitry Kolosov

Curtis D Moyer

Robert T Smith

Charles D Lang

Sung P Pack

Robert J Adler

Lawrence N Dworsky

Albert Alec Talin

Kenneth Andrew Dean

Scott V Johnson

Ian David Parker

Joyce K Yamamoto

Peter A Smith

Robert C Rumbaugh

Nigel Morton Coe

Rob Rumbaugh

Carl R Hagen

Ameen K Saafir

David M Rice

Lingling Wu

John Penczek

An electrical device containing pixel circuits, where at least one resistor is present within one pixel circuit to mask systematic luminance variation in organic light emitting diodes. The resistor can be located at one or more locations between electrodes. Each resistor has a defined resistor density, with distinct resistor values among pixel circuits to produce random variations in pixel luminance across a display containing plurality of pixel circuits.

Electrical device to mask systematic luminance variation

An electronic device can include an organic diode and a shunt that allows a significant current to bypass the organic diode, wherein the shunt is separate from the organic diode. Alternatively, an electronic device can include an organic diode lying along a first conduction path. The electronic device can also include a resistive member lying along a second conduction path that is parallel to the first conduction path. In another aspect, a process of forming an electronic device can include forming a first conductive member, forming a resistive member over the first conductive member, and forming an organic semiconductor layer over the first conductive member. The process can also include forming a second conductive member over the resistive member and the organic semiconductor layer, such that the resistive member and the organic semiconductor layer lie along parallel conduction paths between the first and second conductive members.

Electronic device including an organic diode and a shunt and a process of forming the same

A process of forming an electronic device is disclosed. An organic device layer is formed. The organic device layer includes a charge-selective material and a radiation sensitizer and has a first electrical conductivity and a first surface energy. First portions of the organic device layer are selectively exposed to radiation. The electrical conductivity and surface energy of the first portions of the organic device layer are modified.

Process for forming an organic electronic device including an organic device layer

Organic electronic devices that include dummy electrodes are described, along with methods for using such devices.

Organic electronic device and processes for forming and using the same

Defects are detected in organic electronic device displays such as organic light emitting diode (OLED) displays. An infrared camera may be used to screen displays for defects and to identify the locations of the defects. Relative hot or cold areas in a display correspond to defects and can be detected using the infrared camera.

Organic electronic device display defect detection

A field emission source comprising a first conductive region, a layer of nanotubes deposited on the first conductive region, and a second conductive region placed over and spaced from the nanotube coated first conductive region. After the device structure is fabricated, a laser beam is used to dislodge one end of the nanotube from the first conductive surface and an electric field is simultaneously applied to point the freed end of the nanotube at the second conductive region.

Method for activating nanotubes as field emission sources

A field emission device ( ) includes a cathode plate ( ) having a back plate ( ) made from glass and an anode plate ( ) having a transparent substrate ( ) also made from glass. A first charge control electrode ( ) is affixed to a distal surface ( ) of back plate ( ), and a second charge control electrode ( ) is affixed t0 the periphery of transparent substrate ( ). A ballast resistor ( ) is disposed on a proximate surface ( ) of back plate ( ). A method for operating told omission device ( ) includes the stop of controlling a potential applied to first charge control electrode ( ) in a manner sufficient to control the conductivity of ballast resistor ( ) and provide an electron current ( ) that is constant. The method further includes the step of controlling a potential applied to second charge control electrode ( ) in a manner sufficient to prevent arcing due to wild up or charge within transparent substrate ( ).

Field emission device and method of operation

A field emission display ( ) includes a cathode assembly ( ), an anode plate ( ), and a spacer ( ), which extends between the cathode assembly ( ) and the anode plate ( ). The spacer ( ) is comprised of a spacer material having a dielectric constant less than 100. A discharging period neutralizes positive electrical charge ( ) and renders the spacer ( ) invisible to a viewer of the field emission display ( ). Operating a field emission display ( ) to render a spacer ( ) invisible by providing a cathode, assembly ( ), an anode plate ( ), and a spacer ( ) comprised of a spacer material with a dielectric constant less than 100 and neutralizing positive electrical charge ( ) on spacer ( ).

Field emission display having an invisible spacer and method

A field emission device (100) includes an electroplated structure (122) and an electron emitter (118). Electroplated structure (122) includes a base (124), which is disposed proximate to electron emitter (118) and is made from the same material from which electron emitter (118) is made. Electroplated structure (122) further includes an electroplating electrode (126), which is disposed on base (124), and an electroplated layer (128), which is disposed on electroplating electrode (126). A method for fabricating field emission device (100) includes a step of forming electron emitter (118) and further includes a step of forming base (124) during the step of forming electron emitter (118). The method further includes a step of completely encapsulating electron emitter (118) prior to a step of forming electroplated layer (128).

Field emission device having an electroplated structure and method for

A method for reducing charge accumulation in a field emission display (100) includes the steps of causing a plurality of electron emitters (114) to emit electrons (132) to reduce the potential at an anode (124) of the field emission display (100). Upon the reduction of the potential at the anode (124), the electrons (132) neutralize a positively electrostatically charged surface (129) of a spacer (130). The anode potential is dropped by providing a resistor (127) in series with a voltage source (126) connected to the anode (124). The anode potential is reduced by causing the electron emitters (114) to emit simultaneously to provide a pull-down current (128) at the anode (124). The voltage at the anode (124) is reduced to a value that causes a sufficient flux of electrons (132) to be attracted to the charged surfaces (129) for neutralizing them.

Method for reducing charge accumulation in a field emission display

A field emission display (100) includes a cathode plate (110) having a plurality of electron emitters (114), an anode plate (122) having an anode (124) connected to a potential source (126), and an anode voltage pull-down circuit (127) having an input (106) and an output (104). Output (104) is connected to anode (124), and input (106) is connected to potential source (126). Preferably, anode voltage pull-down circuit (127) causes an anode voltage (120) at anode (124) to drop to about ground potential prior to generation of a discharge current by electron emitters (114) for neutralizing positively electrostatically charged surfaces (137, 138) within field emission display (100).

Field emission display and method for the operation thereof

A field emission display (100) includes a dielectric layer (132) having a plurality of emitter wells (134), a plurality of electron emitters (136) disposed one each within the plurality of emitter wells (134), a plurality of conductive rows (138, 140, 142) disposed on the dielectric layer (132) and having sacrificial portions (154), an ion shield (139) disposed on the dielectric layer (132) and spaced apart from the sacrificial portions (154) of the plurality of conductive rows (138, 140, 142), and an anode (121) opposing the plurality of electron emitters (136) and defining a projected area (122) at the plurality of conductive rows (138, 140, 142). The sacrificial portions (154) of the plurality of conductive rows (138, 140, 142) extend beyond the projected area (122) of the anode (121).

Field emission display having an ion shield

A field emission device (100, 200) includes an anode (190); a substrate (110); a plurality of spaced apart cathodes (120); a dielectric layer (124) disposed on the cathodes (120); a plurality of spacer pads (130, 230) disposed on the substrate (110) between adjacent cathodes (120) and including a spacer contact layer (142, 185) that defines the surfaces of the spacer pads (130, 230); a spacer (150) having a first edge (157), a second edge (155), and a conductive layer (152) disposed on the second edge (155), the first edge (157) contacting the anode (190), the conductive layer (152) contacting the spacer contact layer (142, 185) at the spacer pads (130, 230); and an electron emitter (170) disposed within the dielectric layer (124) and spaced apart from the second edge (155) of the spacer (150).

Growing community of inventors

Mesa, AZ, United States of America

Johann T Trujillo