Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Wacker Chemitronics Gmbh

Johann Niedermeier

Gerhard Brehm

Johann Glas

Karlheinz Langsdorf

Rudolf Mayrhuber

Joachim Junge

Bernd Schiele

A method for the generation of stacking-fault-induced damage on the back of emiconductor wafers is by treating the back with loose hard-material particles which are suspended in a liquid. The back of the semiconductor wafer is brought into contact with the suspended hard-material particles and the hard-material particles are propelled tangentially to the back, under which circumstances they exert on the back of the semiconductor wafer forces which have essentially only tangentially directed components.

Method for the generation of stacking-fault-induced damage on the back

In a method and apparatus for monitoring the path of the cut in slicing wrs from non-magnetizble crystalline workpieces with a slicing tool which is moved through the workpiece, a measuring unit is disposed in a defined position with respect to the slicing tool and a constant magnetic field is established between the measuring unit and the slicing tool. The magnetic field during the slicing process passes at least partly through the wafer to be sliced off and varies with deviations of the slicing tool from the required line of cut established between the fixed measuring unit and the slicing tool. By measuring the change in the constant field caused by the deviation of the slicing tool, the slicing tool can be brought back into the required direction again by regulation so that wafers with excellent planarity are obtained.

Method and apparatus for slicing crystalline wafers aided by magnetic

A process for the sawing of crystal rods or blocks into thin wafers by innal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.

Process for sawing crystal rods or blocks into thin wafers

Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.

Process for sharpening cutting-off tools and cutting-off process

A process and apparatus for supporting crystalline wafers utilizing the sion effect of flowing gas on the crystalline wafers. An almost point-like support of the crystalline wafer is achieved. Furthermore, the invention relates to a holding tool for carrying out the process, which tool has at the center of the holding face, a point-like projection.

Growing community of inventors

Burgkirchen, Germany

Johann Niedermeier