Infineon Technologies Ag

Johann Kosub

Michael Ledutke

Roman Peters

A method for a virtual assistant is provided. The method includes controlling, in a first operation mode, at least one sensor to sense a physical quantity. Further, the method includes receiving, in the first operation mode, sensor data indicative of the physical quantity from the at least one sensor. Additionally, the method includes processing, in the first operation mode, the sensor data to detect whether the sensor data exhibit a predetermined characteristic. If the predetermined characteristic is detected in the sensor data, the method includes setting the operation mode of the virtual assistant to a second operation mode assigned to the predetermined characteristic.

Method for a virtual assistant, data processing system hosting a virtual assistant for a user and agent device for enabling a user to interact with a virtual assistant

In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.

Apparatuses and methods for gas mixed liquid polishing, etching, and cleaning

A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite wafer, thereby generating a plurality of composite chips each including a semiconductor chip and a reinforcing chip.

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Neutraubling, Germany

Johann Kosub