Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Johann Glas

Gerhard Brehm

Johann Niedermeier

Guido Wenski

Thomas Altmann

Gerhard Heier

Karlheinz Langsdorf

Joachim Junge

Double-side polishing process with reduced scratch rate and device for carrying out the process

In a method and apparatus for monitoring the path of the cut in slicing wrs from non-magnetizble crystalline workpieces with a slicing tool which is moved through the workpiece, a measuring unit is disposed in a defined position with respect to the slicing tool and a constant magnetic field is established between the measuring unit and the slicing tool. The magnetic field during the slicing process passes at least partly through the wafer to be sliced off and varies with deviations of the slicing tool from the required line of cut established between the fixed measuring unit and the slicing tool. By measuring the change in the constant field caused by the deviation of the slicing tool, the slicing tool can be brought back into the required direction again by regulation so that wafers with excellent planarity are obtained.

Method and apparatus for slicing crystalline wafers aided by magnetic

A process for the sawing of crystal rods or blocks into thin wafers by innal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.

Process for sawing crystal rods or blocks into thin wafers

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Burghausen, Germany

Johann Glas