Intel Corporation

Biamp Systems Corporation

Johan Ploeg

David Pidwerbecki

Matthew Dore

Tok Doun

Christopher Matthew Barrow

Jake Chervin

Wim Willy J Corten

Seri Lee

An example apparatus includes a speaker housing with a recessed portion having a spring-loaded lip and a set of leads to provide power to the speaker when connected to a lead, and a lead interface plate external to the speaker housing with a set of leads to match the leads in the speaker housing, and when press-fitted into the recessed portion, provides a locked position with one side of the lead interface plate secured in front of the spring-loaded lip.

Speaker configuration and housing

In one embodiment an ionic airflow system comprises an anode, a cathode platform having an elongated surface, and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform. Other embodiments may be described.

Ionic cooling assembly for electronic device

Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.

Spring loaded heat sink retention mechanism

Growing community of inventors

Hillsboro, OR, United States of America

Johan Ploeg