U.S. Philips Corporation

Koninklijke Philips Corporation N.V.

Johan Bosman

Raymond J Van Kooyk

Marc Andre De Samber

Johannus Wilhelmus Weekamp

Roelf Anco Jacob Groenhuis

Renatus Hendricus Maria Sanders

Peter Wilhelmus Maria Van De Water

Willem Hoving

Johannes P Van Dooren

Raymond J L Van Kooyk

A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this

The invention relates to a method of manufacturing an electronic component (), in particular a semiconductor component (), which is provided with electric connection regions (), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (). In a method according to the invention, the component () is attached with one () of its sides () to a foil () by means of an adhesive layer (), and the component is provided, on said side (), with the mark (M) through the foil () and the adhesive layer (). In this manner, a large number of components () can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer () is very well feasible. The component () can be attached to the foil () without contact between the electric connection region () and the adhesive layer. Preferably, a large number of components () are manufactured simultaneously and within a single body () that is attached to the foil (). After the provision of the mark (M), the components () are separated from each other.

Method of manufacturing an electronic component and electronic component obtained by means of said method

A method of providing an encodable layer on a glass object and on the resultant product. Said layer is formed by providing a paste containing glass frit, pigment and a binder, on the hot glass. As a result, the glass frit melts, causing the pigment to adhere to the glass object. The binder, which is used to render the paste spreadable, disappears from the mixture.

Producing a glass object having an encodable layer

The invention relates to a method of providing an encodable layer on a glass object and on the resultant product. The layer is formed by providing a paste containing glass frit, pigment and a binder, on the hot glass. As a result, the glass frit melts, causing the pigment to adhere to the glass object. The binder, which is used to render the paste spreadable, disappears from the mixture.

Glass object having an encodable layer

A method of producing a surfacial marking (11) on a surface (1b) of a body (1) of transmissive material, whereby use is made of a laser beam (5) having a wavelength .lambda. to which the material is substantially transparent, which method comprises the following steps:

Method of producing a patterned surfacial marking on a transparent body

A method of selectively removing a metallic layer (3) from a non-metallic substrate (1) includes the steps of arranging for the metallic layer (3) to be overlaid by a coating (7) of Sn-rich metallic material, and directing a laser beam of wavelength .lambda. onto a selected area (5') of the coating (7), .lambda. being chosen to lie in the range 450-650 nm, thereby causing localized heating of the coating (7) in this area (5') and consequent ablative removal of the underlying portion of the metallic layer (3). The method is particularly useful in the manufacture of printed circuit boards.

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Eindhoven, Netherlands

Johan Bosman