Advanced Micro Devices Corporation

Joern Schnapke

Frank G Kuechenmeister

Kerstin Siury

Niels Rackwitz

By evaluating a status signal on the basis of a fault detection classification mechanism in an electrochemical etch tool, a corresponding failure status of the tool may be obtained for each single substrate, thereby significantly reducing the risk of significant yield loss compared to conventional strategies. The fault detection and classification mechanism may be advantageously applied to the electrochemical removal of underbump metallization layers during the formation of solder bump structures.

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Radebeul, Germany

Joern Schnapke