Micronas Gmbh

Joerg Krause

Hans-Guenter Zimmer

A method for producing a defect card for individual dies located on a wafer, comprising: producing first and second defect cards, where the defective individual dies whose adjoining individual dies form an environment having a defect density up to a first value (&#x3b4;) are classified as defective on the first defect card, and where the defective individual dies which are not considered upon the production of the first defect card are classified as defective on the second defect card; producing a third defect card by classifying additional individual dies on the second defect card as defective, where adjoining individual dies of the additional defective individual dies form an environment having at least one defect density of a second value (&#x3b4;), which second value is less than the first value (&#x3b4;); and producing a fourth defect card by unifying the third defect card with the first defect card.

Growing community of inventors

Freiburg, Germany

Joerg Krause