Lpkf Laser & Electronics Ag

Lpkf Cad/cam Systeme Gmbh

Joerg Kickelhain

Gennadij Kusnezow

Bruno Vitt

Olaf Schulz

Frank Imkenberg

Dieter Biere

A method for making a marking which is located beneath the surface of a glass body, in which the glass has a transmission curve with a plateau area at wavelengths which are longer than those of X-rays. A laser beam is directed onto a surface of the body. The laser beam can penetrate the body to a predetermined depth of the marking and is focused at the predetermined place of the marking inside the glass. The laser beam has a power density high enough to mark this location, essentially without changing the surface of the glass body in any perceptible way. The method is characterized in that a wavelength of the laser is used which makes the glass partially translucent and which is shorter than all the wavelengths of the laser light corresponding to the plateau area of the respective transmission curve. Using this method, very fine markings can be produced spaced a small distance underneath the surface of the glass body.

Method for making a marking in a glass body

The invention relates to methods for measuring the sorbate content in substrates, using a sensor with a measuring chamber. Said chamber contains a support medium whose partial pressure of sorbate is determined in order to determine the sorbate content of the substrate. According to the first method, the temperature of the support medium is varied up to a value at which the partial pressure of sorbate in the measuring chamber no longer varies with the temperature of the support medium, and slightly over this value. This partial pressure of sorbate is then used to determine the sorbate content of the substrate. According to the second method, the temperature of the support medium is kept essentially constant and the speed at which the partial pressure of sorbate of the support medium approaches the stable end value is determined. The sorbate content of the substrate is then determined taking into account the known dependency relationship between said speed and the vapor or solution partial pressure in the substrate. The two methods provide a way of measuring relatively high humidity contents of substrates based on the determination of the equilibrium moisture content.

Methods for measuring the sorbate content of substrates

Coating for the structured production of conductors on the surface of

A method for patterned metallization of substrate surfaces, especially circuit boards, even three-dimensional ones, by using electromagnetic UV radiation, particularly from an excimer laser. In the method a primer layer is applied to the full substrate surface in the area of a metal layer that is subsequently applied; insulating channels then are made in the primer layer by complete removal of the primer in certain areas by the action of electromagnetic radiation in the UV range; and afterward the remaining patterned primer layer is provided with the metal layer to form conductor strips. The method makes it possible to create insulating channels with extremely sharp contours in the primer layer on the surface of even three-dimensional, electronic circuit media.

Method of patterned metallization of substrate surfaces

A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath. The method facilitates patterned metallization with a very high resolution on the surface of substrates, without the need for an etching procedure.

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Neustadt, Germany

Joerg Kickelhain